The application window is expected to close on: 09/30/2026
Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.
Your Impact
As a Package Layout Team Leader, you will lead and grow the San Jose layout team while supporting the execution of complex package programs. You will provide technical guidance, mentorship, resource coordination, and people leadership for package layout activities across advanced ASIC packaging projects.
Working closely with package leads, SI/PI teams, and the global layout organization, you will help strengthen layout engineering capability, improve methodologies and flows, and support high-quality package implementations. This role combines technical leadership, team development, and cross-functional collaboration in a fast-paced and highly collaborative engineering environment.
Responsibilities:
• Lead and support the San Jose package layout team, providing technical guidance, mentorship, and day-to-day support to layout engineers.
• Support package layout activities for complex ASIC packaging projects, ensuring high-quality implementation aligned with package design, SI/PI, and manufacturing requirements.
• Collaborate closely with package leads, SI/PI teams, silicon floor planning, and manufacturing partners to resolve technical and process challenges.
• Coordinate layout resource allocation, priorities, and staffing across multiple concurrent projects.
• Support optimization of package pinouts, stack-ups, power distribution, escape routing, and high-speed interface implementation.
• Partner with the global Package Layout Manager and other regional leaders to align methodologies, tools, best practices, and engineering standards across sites.
• Contribute to hiring, onboarding, mentoring, and development of layout engineering talent in San Jose.
• Work with vendors and contractors as needed to support project execution and delivery goals.
• Drive continuous improvement in layout methodologies, quality, and engineering efficiency.
Minimum Qualifications
• Bachelor's degree in Electrical Engineering or a related field with 12+ years of work experience or Master's degree in Electrical Engineering or a related field with 8+ years of work experience or PhD in Electrical Engineering or a related field with 5+ years of work experience .
• 5+ years of experience in package layout or advanced PCB/package implementation.
• Prior experience working with high-speed routing, power distribution networks (PDN), and package layout design principles.
• Experience with industry-standard EDA tools for package layout and design.
Preferred Qualifications
• Experience leading or mentoring layout engineers or small technical teams.
• Proficiency with Cadence APD+ or equivalent package layout tools.
• Experience with ASIC package layout implementation, including high-speed interfaces and complex escape routing.
• Prior experience with SI/PI considerations and collaboration with cross-functional engineering teams.
• Experience working with vendors or outsourced layout resources.
• Experience with scripting languages such as Python, Perl, or TCL
