The application window is expected to close on: 09/21/2026
Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.
Your Impact
In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high-speed, robust, and manufacturable package solutions.
You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.
Responsibilities:
• Contribute to package design activities including planning, floorplanning, pinout optimization, stack-up definition, and high-speed routing support.
• Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high-quality package solutions.
• Support package implementation activities and work closely with layout editors to ensure alignment between design intent and physical implementation.
• Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.
• Assist in developing and improving package design methodologies, flows, and best practices.
• Contribute to debugging, issue resolution, and package bring-up activities as needed.
• Work with package leads and senior engineers on complex package programs and progressively take ownership of larger design scopes.
Minimum Qualifications
• Bachelor's with 5+ years of experience or Master's degree with 3+ years of experience in Electrical Engineering or a related field.
• Experience in hardware, package, PCB, or high-speed design engineering.
• Experience of high-speed signaling, power delivery, and system-level hardware concepts.
• Prior experience with industry-standard EDA tools for package or PCB design.
Preferred Qualifications
• Experience in ASIC package design, PCB design, or related high-speed hardware development.
• Experience with SI/PI concepts and collaboration with cross-functional engineering teams.
• Experience with advanced packaging technologies, interposers, or multi-die systems is an advantage.
• Experience with scripting languages such as (Python, Perl, TCL, or shell)
