About the role:Own the test that proves our AI accelerator hardware works - from the packaged units, to the boards they sit on, to the systems they ship in. You'll develop the test setups, test hardware, and coverage/yield/throughput that let us catch problems early and ship at volume. You'll sit at the seam between silicon/packaging and the systems our accelerators run in, and own the test strategy that spans package level, board level, and - increasingly - full system level.
What you'll do- Develop and run package-level test - socket-based bring-up and validation of packaged units: power-up, interface/interconnect continuity, and functional/parametric checks against spec (board13package interface, not ATE silicon device test)
- Develop and run board-level test - functional, structural (boundary scan/JTAG), in-circuit, and bring-up validation for accelerator boards and system hardware
- Build out system-level test - bring up and validate assembled accelerator systems against spec, including functional, stress, and burn-in flows
- Design and validate test hardware and fixtures - sockets, connectors, load boards, and board/system fixtures for high-speed and high-current test
- Drive test coverage, yield analysis, and test-time/cost reduction across the product lifecycle
- Lead new-product test bring-up; resolve test escapes, yield excursions, and hardware failures with data-driven root cause
- Run characterization and correlation across levels - package 13 board 13 system, and bench 13 production test
- Define test specs, limits, and guardbands with design, product, packaging, and reliability engineering
- Transfer and sustain test programs at OSAT/CM and manufacturing partners through ramp to high volume
- Use and develop AI-assisted tool flows to accelerate test development, debug, and yield analysis
What we're looking for- BS/MS in Electrical/Computer Engineering or equivalent plus 5+ years in package/board/system-level hardware test engineering
- Hands-on test experience across at least two of package-level, board-level, and system-level test - with the ability to own the others
- Package and board test hardware experience (sockets, connectors, load boards, fixtures) and the signal/power integrity that comes with high-speed, high-current test
- Lab bring-up and debug skills: oscilloscopes, logic and protocol analyzers, power and thermal instrumentation
- Data analysis and statistical skills for yield, characterization, and correlation work
- (Optional) High-speed I/O / SerDes, DDR/HBM, RF, or high-current/power-device test; structural test (boundary scan); scripting/automation (Python, C++); system burn-in and reliability test; OSAT/CM partner management
CompensationFinal offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.
Visa SponsorshipDensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Export ControlsAspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.
