About the roleOwn the mechanical design of AI accelerator systems from the accelerator board to the tray, rack, and datacenter. You'll design power delivery, cooling, and high-speed signal connectivity systems for extremely dense, high-performance computing equipment. You'll own the tolerance stack-ups that make module, tray, and rack actually fit together, run the structural and shock-and-vibration analysis that proves it survives shipping and deployment, and work the tradeoffs with thermal, electrical, and silicon packaging engineering teams that decide what the system can be. Work from concept through datacenter deployment.
What you'll do- Accelerator module mechanical design - module structure, retention and load, board and coldplate integration, PCBA co-design and stress analysis, coolant and air flow co-design, and connector definition
- Tray design - chassis structure, component layout, cable and connector routing, blind-mate alignment, and serviceability
- Partner with thermal, electrical, packaging, and manufacturing teams on design tradeoffs, and drive DFM and DFA with our CM and ODM partners.
- Own products through their lifecycle including design, prototyping, engineering and reliability validation campaigns, New Product Introduction, High Volume Manufacturing, field failure analysis and service
- Rack-level mechanical architecture - structure and weight distribution, power and cooling distribution, cable management, and compliance with datacenter rack standards
- Integrate liquid cooling at system scale, including cold plate mounting, manifold routing, quick disconnects, and leak detection and containment
- Drive structural and dynamic analysis (FEA, shock and vibration, seismic, shipping) and own tolerance stack-up and GD&T across the module-to-tray-to-rack interfaces
- Use and develop AI assisted tool flows to accelerate mechanical design, analysis, and signoff timelines
What we're looking for- Exceptional abilities in system-scale mechanical design for high-power electronics: enclosure and chassis structure, thermal and mechanical integration, and design for service and manufacturability
- 5+ years of mechanical design experience on datacenter, server, or comparable high-power electronic systems, with demonstrated ownership of a design from concept through high-volume production
- Highly capable in 3D CAD modeling
- Proficiency designing for a broad range of low and high-volume manufacturing techniques, including machining, stamping, forming, additive, extrusion, casting, welding, brazing, bonding, injection molding, overmolding, soldering, and other processes
- Structural, transient, and multiphysics analysis skills including finite element analysis
- Demonstrated ability to work closely with thermal, electrical, packaging, and manufacturing teams, and with CM and ODM partners, to converge and release system designs
- Skilled in mechanical tolerance analysis, GD&T, and mechanical drawing creation
- Engineering validation test campaign definition and ownership
- Strong design documentation and organizational discipline including experience releasing and revising detailed engineering drawings and managing documentation in PLM systems to ensure that manufactured parts meet engineering specifications and have adequate traceability
- (Optional) OCP and EIA-310 rack standards, OAM / UBB or comparable accelerator module form factors, liquid cooling and manifold integration, high-current busbar and power distribution mechanical, or seismic and shipping qualification
CompensationFinal offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.
Visa SponsorshipDensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Export ControlsAspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.
