Full Job Description
Analog Devices is seeking a detail-oriented FIB Technician to support Production Fab operations through timely, high-quality physical failure analysis and process characterization. This is a compressed work schedule position that may include Saturday or Sunday coverage and 3-day 12-hour or 4-day 12-hour shifts based on business needs. The role supports fab-critical activities such as tool and process qualification, lines down response, uncontained excursion support, and scrap disposition. The technician will primarily perform FIB cross-sections and SEM imaging, while contributing to broader analytical workflows and learning additional advanced techniques such S-TEM, as needed.
Responsibilities:
• Perform FIB cross-sections and SEM imaging to evaluate process integrity, defect mechanisms, and structural characteristics on semiconductor devices. Support additional sample-preparation approaches, including S-TEM lift-out, as needed and as experience develops.
• Support the Production Fab through rapid physical analysis for tool and process qualification, lines down events, uncontained excursions, scrap disposition, and other high-priority production issues.
• Manage work from the online request system by interpreting analysis needs, selecting appropriate approaches, identifying when additional techniques may be helpful, and clarifying ambiguous or incomplete requests directly with requestors.
• Prioritize incoming requests based on fab urgency, business impact, and operational need while working within a compressed schedule that may include Saturday or Sunday coverage and 3-day 12-hour or 4-day 12-hour shifts based on business needs.
• Partner with fab, process, product, and failure analysis teams to identify root cause, contain issues, and communicate clear analytical findings, risks, and recommendations to engineering stakeholders.
• Maintain equipment, workflow readiness, and compliance with lab safety, cleanroom protocols, and operating standards while driving improvements in throughput, repeatability, and data quality.
Requirements:
• Minimum associate’s degree, technical certification, or equivalent hands-on experience in Materials Science, Electrical Engineering Technology, Physics, Chemical Engineering Technology, or a related technical field; relevant semiconductor lab or failure analysis experience may be considered in lieu of formal education.
• Hands-on experience with FIB cross-sectioning and SEM imaging in a semiconductor production, process characterization, or failure analysis environment.
• Ability to manage ambiguous or incomplete requests by asking clarifying questions, interacting effectively with requestors, and prioritizing work based on urgency, technical need, and fab impact.
• Strong written and verbal communication skills, with the ability to work effectively in a fast-paced fab support environment and clearly communicate technical findings to cross-functional engineering teams.
Job Req Type: Experienced
Required Travel: No
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $38 to $53.
• Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
