Electroplating EngineerPhiladelphia, PA
The OpportunityEnaChip is looking for an Electroplating Engineer who wants to define, optimize, and own the electroplating process. This is an opportunity to scale a process from R&D to wafer- and panel-level production, working at the leading edge of a platform that's bringing magnetics directly into the semiconductor stack. You'll join a young, growing team, with real opportunities to move into a leadership role as the company scales. This position will work onsite in Philadelphia.
Key Responsibilities- Develop and optimize electroplating processes for magnetic alloy deposition
- Characterize processes, improve yield, and integrate electroplating with semiconductor fabrication flows
- Scale electroplating processes from R&D to wafer- and panel-level production
- Collaborate with materials and design teams to tune conductor and magnetic layer properties
Qualifications- Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, or related field
- 3-5 years of experience with electroplating/electrochemical deposition in a semiconductor or advanced manufacturing environment
- Experience with multiple power supply types, bath metrology/monitoring equipment, SPC/DOE and related software (JMP), and thin-film characterization
- Knowledge of plating bath chemistry, current density optimization, and thin-film characterization
- A strong process-ownership mindset - you define it, you build it, you scale it
Nice to Have- Experience in a startup or early-stage hardware environment
Compensation- Base salary range: $90,000-$115,000, commensurate with experience and qualifications
- Total compensation includes equity in a rapidly growing start-up
