Minimum qualifications:- Associate's degree, trade school certification, other verifiable training in a relevant technical field, or equivalent practical experience.
- 3 years of experience in laboratory safety protocols (chemicals, lasers, high voltage, etc.), mechanical metrology (CAD, use of calipers, micrometers, gauge blocks, dial indicators, Instron, etc.), and electrical metrology (multimeter, O-scope, etc.).
- Experience with electronics rework, micro-soldering, or hardware repair.
Preferred qualifications:- Mastery of hot air rework stations, precision soldering irons, pre-heaters, and stereo microscopes.
- 3 years of experience in Vendor Management and Procurements (Procurement of electromechanical and laboratory components), PCB and FPCB rework (soldering, de-soldering, crimping, etc.), and Fabrication Techniques used for rapid prototyping (Laser cutting, 3D printing, drill press, band saw, etc.).
- 3 years of experience creating and maintaining technical documentation (Drawings, Schematics, SOPs, etc.).
- 3 years of experience integrating complex systems (audio, video, compute, optics, etc.).
- 3 years of experience testing, troubleshooting, and with failure analysis.
About the jobWe are seeking a highly skilled and detail-oriented Electronics Lab Technician to specialize in the assembly, testing, and delicate hardware rework of mobile devices, with a primary focus on the Google Pixel product line.
In this role, you will be responsible for component-level troubleshooting, precision micro-soldering, and the careful disassembly/resembly of prototype or production-level smartphones. You will have a steady hand, experience under a microscope, and a strong understanding of modern smartphone hardware architecture.
Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
US: $99000 - $141000 (USD) 15% bonus target equity benefits
Responsibilities- Perform high-quality, precision micro-soldering and rework on multi-layer Printed Circuit Boards (PCBs), including managing surface-mount technology (SMT), Ball Grid Arrays (BGAs), 01005 components, and fine-pitch connectors.
- Disassemble and reassemble phone devices without damaging sensitive internal components (e.g., flexible printed circuits (FPCs), OLED screens, under-display fingerprint sensors, and battery thermal pads).
- Utilize schematics, board layout software, and test equipment (e.g., oscilloscopes, digital multimeters, DC power supplies) to diagnose hardware failures, short circuits, or component degradation.
- Execute post-rework testing protocols to ensure cellular, Wi-Fi, camera, audio, and power management systems are fully functional.
- Maintain accurate logs of modifications, rework history, and failure analysis. Keep the ESD-safe (Electrostatic Discharge) workstation and lab tools calibrated and clean.
