Group/Division
With over 40 years of semiconductor process control experience, chipmakers around the globe rely on KLA to ensure that their fabs ramp next-generation devices to volume production quickly and cost-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The Broadband Plasma Division (BBP) provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes. BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.

Job Description/Preferred Qualifications

Major responsibilities include

• Participate in all phases of PCB & FPGA design flow - from concept to wafer inspection tool integration
• Participate in Analysis of high-speed image datapath bandwidths to support real-time processing
• Participate in Risk Tradeoff Analysis in PCB Architecture, Component Selection, Placement and Routing
• Model and Simulate High Speed Circuits for Risk Identification using ADS and LTSPICE
• Derive FPGA high speed interface, power and clock requirements from FPGA data sheet and Place and Route reports.
• From Power Requirements, design FPGA Design Power Distribution Networks, including power plane placement solutions
• Work with Suppliers to Identify and Qualify new Components as needed for PCB Design
• Work with Suppliers to define PCB Stackup
• Bring up and validate FPGA design in the lab and utilize various lab equipment.
• Collaborate with software engineers to integrate the design into the wafer Inspection tools.
• Contribute to all phases of hardware development, including creating design documents, reviewing schematics, bringing up new hardware, and defining/overseeing/performing unit and system tests.
• Validate PCB design and Support manufacturing release.
• Documentation of all aspects of design flow: Requirements, Concept, Detail Design, Layout Directives, Test Plan and Procedure, along with presentations
• Support Field Escalations'

Qualifications/Education Desired

• Demonstrated Track Record in PCB Design and Implementation
• Experience designing hardware (schematic entry, layout, simulation) and debugging
• Experience designing DSP and/or image processing datapath a plus
• Strong programming and scripting skills: MATLAB, Python, C/C++, Perl, Tcl
• Understanding of clock domain crossing (CDC) techniques
• Experience in FPGAs, evaluation boards, and knowledge of FPGA design flow
• Understanding industry-standard interfaces, protocols, and architectures: PCIe, Ethernet, DDR, etc.
• Experience in developing automated, self-checking test benches a plus
• Experience in EDA tools such as simulators (e.g., Questa), and FPGA tools (e.g., Vivado, Quartus) a plus
• Knowledge of timing closure techniques for high-speed design
• Strong interpersonal/written/verbal communication skills and experience with cross-functional collaboration
• Strong teamwork skills combined with the ability to work autonomously as an individual contributor

Minimum Qualifications

BS or MS in EE required

5+ years of experience designing PCB and verifying high-speed digital designs on FPGAs for deployed products

Base Pay Range: $117,800.00 - $200,300.00 Annually

Primary Location: USA-CA-Milpitas-KLA

KLA's total rewards package for employees may also include participation in performance incentive programs and eligibility for additional benefits including but not limited to: medical, dental, vision, life, and other voluntary benefits, 401(K) including company matching, employee stock purchase program (ESPP), student debt assistance, tuition reimbursement program, development and career growth opportunities and programs, financial planning benefits, wellness benefits including an employee assistance program (EAP), paid time off and paid company holidays, and family care and bonding leave.

Interns are eligible for some of the benefits listed. Our pay ranges are determined by role, level, and location. The range displayed reflects the pay for this position in the primary location identified in this posting. Actual pay depends on several factors, including state minimum pay wage rates, location, job-related skills, experience, and relevant education level or training. We are committed to complying with all applicable federal and state minimum wage requirements where applicable. If applicable, your recruiter can share more about the specific pay range for your preferred location during the hiring process.