Full Job Description
DUTIES: Provide engineering development support for Surface Acoustic Wave (SAW/SAMO) and Bulk Acoustic Wave (BAW) filter and semiconductor products. Support architecture choices, identify critical parameters, and ensure manufacturability. Help establish specifications, test criteria, and ensure customer/data-sheet compliance. Work with Test Engineering on test implementation, determine product compliance, prepare data-sheet specification proposals, and collaborate with Applications and Marketing Engineering to align performance targets and overall product positioning. Support Quality Engineering with qualification activities and failure analysis during product development. Assist work in high-volume production testing, fab processing, and quality engineering to strengthen manufacturing robustness and accelerate production ramp-up. Support factory performance, yield, and continuous improvement, troubleshoot production issues, prepare reports, and promote cost-reduction initiatives for mature products. Interface with Design, Process, Test, and Reliability Engineering to help solve product-ramp challenges and close technical risks related to schedule, cost, and quality. Apply statistical and automation tools to generate limits, perform correlations, monitor KPIs, and automate analytical workflows. Participate in-product-development to promote full traceability from customer requirements to field performance. Hybrid: Four days in the office with one day optional may work home.
MINIMUM REQUIREMENTS: Bachelor's degree in Electrical Engineering, MechatronicEngineering or related field and 2 years of experience in the semiconductor or radio communications field. Also, 2 years of experience stated herein to include: (1) Acoustic RF filters, SAW and BAW; Radio Frequency and signal processing concepts; (2) SPC data and statistics; semiconductor fabrication; (3) High-Volume Production Test and Quality Engineering; (4) Statistical analysis tools including JMP and Spotfire. Finally, 1 year of experience stated herein to involve: (5) applying knowledge of semiconductor manufacturing processes including wire bonding, SMT, ULC, flip-chip and module lamination; (6) supporting transition of SAW and BAW filter technologies into high volume production; and (7) participating in 8D investigations for internal and external complaints. Hybrid: Four days in the office with one day optional may work home.
This position is not eligible for visa sponsorship by the Company.
