Copy of Copy of Technical Program Manager - SoC Programs

Lumilens

$150K — $180K *
Technical Services
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • 15+ years in technical program or project management within semiconductor or chiplet environments
  • Experience with chip development schedules and ecosystem partners
  • Knowledge of advanced packaging formats like CoWoS and 3D integration
  • Technical fluency in SoC or chiplet design flows
  • Strong communication skills for stakeholder presentations
  • Proficiency in program tracking tools and building infrastructure
  • Familiarity with key high-bandwidth connectivity IPs is a plus

Responsibilities

  • Manage customer engagements from spec alignment to volume shipment
  • Ensure alignment with ecosystem partners throughout the process
  • Translate customer requirements into actionable internal plans
  • Maintain program trackers, risk registers, and executive dashboards
  • Drive gate reviews and weekly syncs across development teams
  • Coordinate scoping and delivery timelines with technical and business teams
  • Identify and mitigate risks early in the project lifecycle

Benefits

  • Opportunity to work directly with founders and key customers
  • High visibility and impact in a rapidly growing startup
  • Engage with a leading semiconductor ecosystem
  • No layers of management hindering communication
  • Chance to shape the company's strategic initiatives at an early stage
Full Job Description
About the role

TylSemi is looking for a Technical Program Manager who can sit at the intersection of silicon, supply chain, and customer success. You will own the operational thread that connects our stretagic initiatives to customers and semiconductor supply chain - making sure every engagement moves with precision from idea to silicon.

This is a high-visibility, high-ownership role at a company in its earliest and most consequential stage. You will work directly with founders, customers, the leading semiconductor ecosystem players. No layers, no ambiguity about impact.

What you'll do

  • Manage all active customer engagements end-to-end: from architectural spec alignment through tape-out, KGD testing, packaging, and volume shipment milestones
  • Ensure alignment with ecosystem partners - including foundries, OSAT/packaging houses, EDA vendors (Synopsys, Cadence), and IP partners
  • Translate customer requirements (silicon architecture, interface specs, package form factor, delivery schedules) into internal program plans with clear owners and dates
  • Build and maintain program trackers, risk registers, and executive dashboards covering each engagement
  • Drive gate reviews and weekly program syncs across internal RTL/DV, physical design, and validation teams
  • Manage internal and external scoping and delivery timelines in coordination with technical and business teams
  • Identify and escalate risks early; propose and implement mitigations before they become schedule threats

What you bring

  • 15+ years of technical program or project management experience in semiconductor, custom silicon, or chiplet/advanced packaging environments
  • Direct experience interfacing with ecosystem partners - chip development schedules, interdepencies on EDA and IP, tape-out schedules and silicon bringup timelines
  • Familiarity with silicon fabrication, advanced packaging formats: CoWoS, InFO, 2.5D/3D integration, substrate/interposer-based assembly
  • Technical fluency in SoC or chiplet design flows - enough to understand RTL milestones, DV sign-off, PD handoffs, and silicon bring-up phases without needing translation
  • Strong communication skills - comfortable presenting program status and risk posture to internal and external stakeholders
  • Proficiency with program tracking tools (and spreadsheet-based trackers); experience building program infrastructure from scratch is a plus
  • Familiarity with key connectivity IPs UCIe, PCIe Gen 5/6/7+, or high-bandwidth D2D interconnect standards is a strong plus

Nice to Have to Shine

  • Prior experience at a chiplet startup, merchant silicon company, or systems company
  • Background in AI/ML infrastructure silicon - accelerators, network switches, CPO-enabled platforms
  • Familiarity with IVR/PMIC integration challenges in advanced packaging
  • Exposure to EDA infrastructure programs (SNPS/CDNS cloud flows)

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