Advanced Micro Devices, Inc

Advanced Package Design Engineer

Advanced Micro Devices, Inc$130K — $180K *
Information Technology
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in engineering or physical science; advanced degree preferred (MS or PhD)
  • 10+ years of relevant experience in advanced packaging technologies
  • Familiarity with 2.5D and 3D packaging design and manufacturing flows
  • Strong understanding of CAD flows for 3DIC product design
  • Exceptional data analysis and problem-solving skills
  • Hands-on experience with EDA tools for design validation and verification
  • Effective communication and interpersonal skills

Responsibilities

  • Define 3DIC and package technologies and optimize them for FPGA and ASIC products
  • Collaborate with design, CAD, and PDK teams for robust 3DIC designs
  • Evaluate and develop new CAD tools and verification flows
  • Manage technical documentation and databases for tape-out success
  • Coordinate testchip designs for technology validation and reliability assessment
  • Analyze product yield and enhance designs through collaborative efforts
  • Explore and support the packaging technology roadmap

Benefits

  • Comprehensive AMD benefits package
  • Health, dental, and vision insurance
  • Retirement savings plans
  • Employee wellness programs
  • Opportunities for professional development
Full Job Description
THE ROLE:

We are looking for an Advanced Package Design Engineer who will be responsible for advanced 2.5D & 3D IC packaging technology evaluation, design enablement/implementation, and product development for FPGA and ASIC products from conception to production.

THE PERSON:

The ideal candidate must be familiar with advanced 2.5D and 3D packaging technologies including design/manufacturing flows, vendor eco-system, yield and reliability qualification and enhancement knobs. A good understanding of CAD flows to support robust 3DIC product and package design is essential. The candidate shall possess effective communication, good interpersonal skills and be able to work seamlessly with design teams, foundry partners, package/assembly vendors and validation teams. Typically, the candidate will hold a degree in engineering or physical science with over 10+ years of relevant experience in the field.

KEY RESPONSIBILITIES:
  • Responsible for 3DIC & Package technology definitions and system-technology co-optimization (STCO) of FPGA and ASIC products in advanced nodes
  • Co-work with design, CAD & PDK teams to accomplish robust 3DIC product and substrate designs
  • Explore, evaluate and develop new CAD tools, design and verification flow
  • Manage design tech files, documentation and databases to enable successful tape-out
  • Coordinate testchip design and tape-out for 2.5D & 3DIC technology validation and reliability assessment prior to production
  • Pursue product yield analysis and design enhancement through collaboration with foundry and design teams to meet AEGC product need
  • Support packaging and 3DIC technology roadmap exploration

PREFERRED EXPERIENCE:
  • Familiar with 2.5D & 3D packaging technologies, including foundry, OSAT, and OEM packaging solutions, advanced interconnect, and substrate technologies.
  • Understand key 2.5D and 3D IC product challenges and solutions including cost, signal/power integrity, thermal management, reliability risks etc.
  • Deep understanding of 2.5D and 3D IC manufacturing and reliability design rule requirements
  • Possess hand-on experience of major EDA tools to support 3DIC product and package design, physical verification, signal and power integrity check, reliability and thermal validation etc.
  • Exceptional data analysis, problem solving, decision making and communication skills
  • Working experience in 2.5D & 3D IC testchip, product design and yield analysis is a plus
  • Team management and cross-functional team experience is a plus

ACADEMIC CREDENTIALS:
  • Bachelor degree in engineering or physical science, strongly preferred with advanced degree (MS or PhD)

LOCATION:

San Jose, CA

This role is not eligible for visa sponsorship.

Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

Advanced Micro Devices, Inc. Careers

Join the innovative forefront of technology with a career at Advanced Micro Devices, Inc. (AMD), a leader in semiconductor development. As part of our global team, you will contribute to an organization renowned for its dedication to innovation, leadership, and diversity in the tech industry.

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Innovative Work Environment

Join a team of over 12,000 dedicated professionals at the intersection of technology, industry expertise, and digital innovation. At AMD, you will work on groundbreaking projects that shape the future of computing and graphics. Our collaborative environment encourages networking and the sharing of ideas across teams and disciplines.

Career Development and Benefits

AMD is committed to the development of its employees. We offer robust training programs, including leadership development and diversity training, to ensure our team is equipped for both current challenges and future opportunities. Our benefits package is designed to support the well-being and financial security of our employees and their families.

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Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ

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