Wireless Chip Architect

Ceva

$130K — $180K *
Telecommunications & Hardware
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • B.Sc. or M.Sc in Electrical Engineering
  • Deep understanding of full-system SoC architecture and connectivity interactions
  • Experience in post-tape-out testing and product qualification
  • Expertise in wireless communication standards (WiFi/BT/Cellular/UWB)
  • Proven experience in ASIC design and successful tape-outs
  • Knowledge of performance and power modeling
  • Strong communication skills for translating complex concepts

Responsibilities

  • Drive full-system view of connectivity subsystem interactions within SoC
  • Define architecture specifications including feature sets and low power modes
  • Lead technical discussions with customers on connectivity options
  • Co-develop solutions with customers and partners during integration
  • Support product lifecycle from testing to production validation
  • Work closely with design teams for implementation success
  • Collaborate with stakeholders to translate feedback into architectural needs

Benefits

  • Strong emphasis on creativity and flexible problem-solving
  • Opportunities for customer-facing technical leadership
  • Potential for cross-functional team collaboration
  • Involvement in state-of-the-art wireless technology developments
  • Engagement in the full product lifecycle from development to production
Full Job Description
Description

About the role:

In this role, you will be at the intersection of cutting-edge wireless technology and direct customer engagement. As a Wireless Architect, you drive the definition of connectivity subsystem architectures for next-generation products including Wi-Fi, Bluetooth, and UWB with mixed analog/digital hardware. You will also serve as a key technical partner for our customers, leading technical pre-sales, co-develop joint solution offerings, and bring a creative, flexible mindset to solving complex real-world connectivity challenges. This requires both architectural depth and strong product engineering experience, from concept through productization.

Responsibilities:

Drive full-system view of how the connectivity subsystem interacts within an SoC, including CPU/processor, memory, and peripheral interfaces

Definition of connectivity subsystem architecture specifications including :

  • Feature-set definition and PPA (Power, Performance, Area) targets
  • Definition of system low power modes and PMU requirements
  • Definition of HW and SW interfaces of the connectivity sub-systems including: HW interfaces, state machines, operation sequences etc...
  • Analog and digital domains partitioning

Customer facing and technical engagement

  • Lead technical discussions with customers, presenting connectivity architecture options and value propositions
  • Co-develop joint solution offerings with customers and partners, acting as technical advisor during system integration phases

Support product lifecycle and productization

  • Support post-tape-out testing, production validation, and productization of wireless connectivity solutions
  • Lead or contribute to production-readiness activities including silicon characterization, yield analysis, and qualification testing

Cross-functional leadership

  • Work closely with logic design, physical design, firmware, and validation teams to ensure successful implementation
  • Support wireless subsystem integration process from architectural definition through implementation, lab integration and test coverage planning
  • Collaborate with product management and business development stakeholders to translate customer feedback into architectural requirements and product roadmap inputs


Requirements

Requirements:

  • B.Sc. or M.Sc in Electrical Engineering
  • Deep understanding of full-system SoC architecture, with emphasis on how connectivity subsystems interact with processors, memory controllers, power domains, and software stacks
  • Product engineering experience: deep understanding of full lifecycle including post tape-out testing, silicon bring-up, productization, and production qualification.
  • Experience in system definition for wireless communication systems
  • Experience in wireless communication standards (such as WiFi/BT/Cellular/UWB)
  • Experience in ASIC design and architecture, with proven experience in successful tape-outs and production
  • Knowledge in performance and power modeling and analysis
  • Deep understanding of VLSI development process and methods
  • Technical leadership
  • Strong communicator, able to translate complex architectural concepts for customers, executives, and engineering teams.
  • Creative and flexible mindset: comfortable navigating ambiguous requirements and proposing pragmatic, innovative solutions
  • Proven customer facing experience. Leading technical discussion, building trust, and influencing design decisions.

Advantages:

  • Knowledge in RF integration and performance optimization
  • Previous experience with 3rd party IP integration
  • Knowledge in CPU/Processor architecture

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