Key ResponsibilitiesWe are seeking a highly skilled and innovative Senior R&D Thermal Engineer to lead the development of advanced thermal management and integration solutions for xPUs, high-density power supplies and power rack systems for datacenter facilities. The ideal candidate will leverage their expertise in liquid cooling technologies and system integration to design and scale next-generation thermal management concepts. This role requires thermal and mechanical design, hands-on problem-solving, technical leadership, a forward-thinking approach to address the challenges of modern computing infrastructures, and customer on-site technical support.
Innovative Thermal Management Design:- Develop cutting-edge thermal management concepts to effectively dissipate heat from xPUs, extending and integrating new thermal solutions on converter- and rack-level cooling for datacenters.
Expertise in Liquid Cooling Technologies:- Design and optimize systems using technologies such as cold plates, liquid cooling, and heat exchangers.
- Investigate and implement emerging cooling techniques, including liquid immersion cooling, microfluidic cooling channels, evaporative cooling, and two-phase cooling systems.
Scalable Solutions:- Engineer thermal management solutions that scale seamlessly from xPUs to entire power racks and datacenters.
Collaboration and Leadership:- Work cross-functionally with hardware design teams and business units to align thermal solutions with company goals.
- Mentor and provide guidance to junior engineers in thermal management techniques and system integration principles.
Minimum Qualifications- Advanced degree (Master's or PhD) in Mechanical Engineering, Thermal Engineering, or a related field.
- Proven experience in developing advanced thermal solutions and integrating them into power electronic systems.
- Deep understanding of cooling technologies, including liquid cooling, two-phase cooling, and heat exchangers.
- Strong background in scaling thermal solutions from component-level to system-level applications.
- Expertise in CFD simulation tools and thermal modeling software (FloTHERM, MacroFlow, ANSYS Icepak).
- Excellent problem-solving skills, with the ability to work on complex, multidisciplinary topics.
- Strong communication and leadership abilities.
Pay RangeUSD $150,000.00 - USD $180,000.00 /Yr.
Preferred Qualifications- Experience with innovative cooling materials.
- Understanding of lifecycle assessment (LCA) and environmental impact analysis for cooling solutions.
- Knowledge of industry standards and regulations for datacenter thermal management and power electronic systems.
- Background in system control and coding, enabling integration of thermal-fluid and control simulations.
- Practical understanding of manufacturing processes (e.g., CNC machining, soldering, brazing, welding).
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