Test Engineer - Flying Probe and ICT

Sanmina-SCI

$70K — $95K *
Manufacturing & Automotive
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical Engineering, Electronics Engineering Technology, or related field.
  • 3+ years of hands-on experience in electronic manufacturing, particularly in test system development.
  • Proficient in test program development on ICT platforms.
  • Strong practical experience with Flying Probe Test technology.
  • Ability to read and interpret complex electrical schematics and BOMs.
  • Solid understanding of common electronic components and circuit theory.
  • Familiar with test coverage analysis and quality methodologies.

Responsibilities

  • Design and debug test programs for ICT and Flying Probe equipment.
  • Generate and maintain test documentation including plans and troubleshooting guides.
  • Collaborate with design engineers on Design for Testability requirements.
  • Monitor test data and yields to identify trends for continuous improvement.
  • Perform root cause and failure analysis on non-conforming products.
  • Maintain and calibrate ICT and Flying Probe test systems.
  • Train technicians and operators on testing procedures and troubleshooting.

Benefits

  • Comprehensive health insurance plans.
  • 401(k) retirement savings plan with company matching.
  • Paid time off and holiday pay.
  • Opportunities for professional training and development.
  • Work in a high-volume, technologically advanced environment.
Full Job Description
Flying Probe and ICT Test Engineer

Job Summary

The Test Engineer will be responsible for the development, implementation, and maintenance of In-Circuit Test (ICT) and Flying Probe Test (FPT) programs and hardware for Printed Circuit Board Assemblies (PCBAs). This role is critical in ensuring the quality and reliability of electronic products by achieving high fault coverage and optimizing test processes in a high-volume manufacturing environment.

Essential Duties and Responsibilities

  • Test Program Development:
    • Design, develop, and debug test programs for bothICT (e.g., Agilent/Keysight 3070)andFlying Probe (e.g., Takaya)equipment.
    • Generate and maintain all required test documentation, including test plans, procedures, and troubleshooting guides.
    • Collaborate with Design Engineering to defineDesign for Testability (DFT)requirements for new product introductions (NPI) to maximize test coverage .
  • Process Optimization and Yield Improvement:
    • Monitor and analyze test data and yields (First Pass Yield - FPY) to identify trends and implementcontinuous improvementactions.
    • Perform detailed root cause analysis and failure analysis (FA) on non-conforming products and test failures (e.g., No Defect Found - NDF).
    • Fine-tune test limits and programs to reduce false failures and improve test cycle time (throughput).
  • Equipment Maintenance and Support:
    • Perform routine and preventative maintenance, calibration, and minor repairs on ICT and Flying Probe test systems.
    • Provide immediate technical support and troubleshooting to production technicians and operators to minimize equipment downtime.
  • Cross-Functional Collaboration:
    • Work closely with Manufacturing, Quality, and Design teams to resolve assembly defects and systemic product quality issues.
    • Train technicians and operators on new test procedures, equipment operation, and troubleshooting techniques.


Required Qualifications

  • Bachelor's degree in Electrical Engineering, Electronics Engineering Technology, or a related technical field.
      • Preferred: Minimum of3+ yearsof hands-on experience in electronic manufacturing, specifically in developing and supporting test systems.
      • Demonstrated proficiency with test program development onIn-Circuit Test (ICT)platforms.
      • Strong practical experience withFlying Probe Test (FPT)technology and programming.
      • Willingness to train: We are open to considering highly motivated candidates with less than 3 years of experience. Successful candidates will be required to participate in and completestructured internal training programstailored to bring them up to proficiency in FPT and ICT methodologies within a defined timeframe.
      • Expert ability to read and interpret complexelectrical schematics, Bill of Materials (BOMs), and component datasheets.
      • Solid understanding of common electronic components (resistors, capacitors, inductors, ICs) and circuit theory.
      • Familiarity with test coverage analysis, statistical process control (SPC), and quality methodologies.
      • Proficiency in scripting or programming languages (e.g., Python, C++, or similar) is a plus.
      • Strong analytical andproblem-solvingabilities with a structured approach to failure analysis.
      • Excellent written and verbal communication skills for technical documentation and team collaboration.

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