Job DescriptionWe are seeking a talented and innovative **Technologist** to join our dynamic team in Milpitas, United States. In this role, you will be at the forefront of technology development, working on cutting-edge solutions that drive our organization forward. As a Technologist, you will combine technical expertise with collaborative problem-solving to design, develop, and validate complex systems. You will work closely with cross-functional teams to translate business requirements into robust technical solutions while maintaining a customer-focused approach and ensuring the highest quality standards.
Essential Duties and Responsibilities:- Design and develop technical solutions that meet customer needs and organizational objectives
- Conduct thorough analysis and testing of systems, identifying potential issues and implementing effective solutions
- Collaborate with system architects, engineers, and stakeholders to develop comprehensive technical strategies and validation plans
- Debug complex technical issues methodically and perform root cause analysis to prevent future occurrences
- Interface with suppliers and/or internal cross functional teams to develop and implement technologies. Work collaboratively with teams.
- Interface with customers and internal teams to understand requirements, gather feedback, and enhance technical solutions.
- Develop and maintain technical documentation, including design specifications, test reports, and implementation guides
- Stay current with emerging technologies and industry best practices, continuously improving skill set and knowledge
QualificationsRequired:- M.S. or preferably Ph.D. in any of the following fields: Physics, Chemistry, Materials Science & Eng, Chemical Engineering
- Proficiency in developing process technologies, either in Si Backend ( metals/dielectrics) or Packaging technologies involving wafer processes.
- Experience in stacking technologies of logic or memory devices with TSVs, either as a module engineer, integration engineer or reliability engineering. Experience in Memory stacking technologies with devices having TSVs a plus.
- Ability to work collaboratively as a team player across multiple departments. Demonstrated capability to build and maintain key relationships with stakeholders
- Strong analytical and problem-solving capabilities
- Proficiency in technical documentation and requirements elicitation
- 3+ years of professional experience in technology development - more specifically in the area of high die count stacking of devices with TSVs.
- Proven experience in innovating and implementing technical solutions for complex process and architectural issues.
- Track record of successfully leading or contributing to cross-functional technical initiatives
- Experience working with diverse stakeholder groups and influencing technical decisions
- Good understanding of advanced packaging technologies as applicable to memory systems.
Preferred:- Experience Si Fab or Packaging Fabs with Wafer level processing and Stacking.
- Background in leading technical teams, process Integration.
- Experience with HBM
- Excellent written and verbal communication skills
- Ability to work effectively under pressure and meet tight deadlines
Additional InformationBased on our experience, we anticipate that the application deadline will be
09/16/2026 (3 months from posting), although we reserve the right to close the application process sooner if we hire an applicant for this position before the application deadline. If we are not able to hire someone from this role before the application deadline, we will update this posting with a new anticipated application deadline.
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Compensation & Benefits Details- An employee's pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs.
- The salary range is what we believe to be the range of possible compensation for this role at the time of this posting. We may ultimately pay more or less than the posted range and this range is only applicable for jobs to be performed in California, Colorado, New York or remote jobs that can be performed in California, Colorado and New York. This range may be modified in the future.
- You will be eligible to participate in Sandisk's Short-Term Incentive (STI) Plan, which provides incentive awards based on Company and individual performance. Depending on your role and your performance, you may be eligible to participate in our annual Long-Term Incentive (LTI) program, which consists of restricted stock units (RSUs) or cash equivalents, pursuant to the terms of the LTI plan. Please note that not all roles are eligible to participate in the LTI program, and not all roles are eligible for equity under the LTI plan. RSU awards are also available to eligible new hires, subject to Sandisk's Standard Terms and Conditions for Restricted Stock Unit Awards.
- We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical/dental/vision insurance; life, accident and disability insurance; tax-advantaged flexible spending and health savings accounts; employee assistance program; other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity; tuition reimbursement; transit; the Applause Program, employee stock purchase plan, and the Sandisk's Savings 401(k) Plan.
- Note: No amount of pay is considered to be wages or compensation until such amount is earned, vested, and determinable. The amount and availability of any bonus, commission, benefits, or any other form of compensation and benefits that are allocable to a particular employee remains in the Company's sole discretion unless and until paid and may be modified at the Company's sole discretion, consistent with the law.
