NXP Semiconductors

Systems IC Architect

NXP Semiconductors$130K — $180K *
Manufacturing & Automotive
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).
  • 15+ years of experience in power semiconductors, packaging, and system-level integration with a focus on Advanced Power Management for PoL solutions.
  • Proven track record in product definition and revenue generation.
  • Strong expertise in thermal management and electrical performance.
  • Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE).
  • Experience in powering high-performance compute SoC platforms with automotive-grade standards as a plus.
  • Ability to lead cross-functional teams and manage complex projects.

Responsibilities

  • Define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions.
  • Develop and maintain long-term product and technology roadmaps with collaboration teams.
  • Translate customer needs into innovative power management solutions.
  • Support development through thermal optimization and electrical analysis.
  • Partner with architects to ensure solutions meet performance, efficiency, space, and cost targets.
  • Lead integration of ICs and power semiconductors into advanced packages and systems.
  • Drive early-phase engineering for AI compute and automotive applications.

Benefits

  • Flexible work locations in San Diego, San Jose, or Austin.
  • Opportunities for professional development and advancement.
  • Participation in innovative projects in advanced power management.
  • Collaborative and creative work environment.
Full Job Description

Locations available: San Diego and San Jose, California or Austin, Texas

Role Overview

We are seeking a visionary System IC Architect with deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies. This role is pivotal in defining next-generation Point of Load (PoL) solutions for APS, driving innovation in advanced power management with System-in-Package (SiP) integration.

We’re looking for a candidate to define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions that meet latest system-level requirements. Key focus areas include high-performance core power for automotive applications and AI compute platforms. The role centers on Advanced Power Management for PoL solutions. Expertise in AI compute power is essential, and experience in automotive power management is a strong plus.

Key Responsibilities – Advanced Power Management & System IC Architecture

Product Definition & Strategy

  • Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams.
  • Translate customer requirements into innovative packaging and power management solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Support development through thermal optimization and electrical analysis.

System-Level Integration

  • Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets.
  • Lead integration of ICs and power semiconductors into advanced packages and systems. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.
  • Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms. Knowledge of AI Compute Power Solutions is critical. Automotive Power Management experience is a plus, highly valued.

Technical Advisory & Reporting

  • Provide strategic insights on state-of-the-art power management technologies and benchmark readiness. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Report KPIs and project status to executive stakeholders.

Preferred Qualifications:

  • Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).
  • 15+ years of experience in power semiconductors, packaging, and system-level integration. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.
  • Proven track record in product definition through revenue realization.
  • Strong expertise in thermal management, electrical performance, and advanced reliability.
  • Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up.
  • Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued.
  • Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508).
  • Demonstrated ability to lead cross-functional, global teams and manage complex projects.
  • Excellent communication and interpersonal skills; ability to collaborate across diverse teams.
  • Creative mindset with strong problem-solving capabilities.
  • Willingness to travel globally.

About NXP Semiconductors

NXP Semiconductors N.V. is a Dutch semiconductor manufacturer with headquarters in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 35 countries, including 11,200 engineers in 33 countries. NXP reported revenue of $8.88 billion in 2020. The company's products are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. NXP is the co-inventor of near field communication (NFC) technology along with Sony and supplies NFC chip sets that enable mobile payments, as well as secure access to cars and buildings.
Learn more about NXP Semiconductors
Size
31,000 employees
Market Cap
$39.8 billion
Industry
Net Income
$52 million
Founded
1953
5 Year Trend
+3.1%
Revenue
$8.6 billion
NASDAQ

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