In your role as a Staff / Principal Wafer Bonding Process Engineer within Micron Technology's DRAM Technology Development group, you will join a worldwide memory development organization. You will contribute to developing modern wafer bonding process technology that keeps Micron at the forefront of memory technology. This position is important because it directly affects product quality, reliability, yield, cost savings, efficiency, and risk control. You will initiate, develop, and fine-tune bonding processes while addressing manufacturing line challenges. You will also manage process, equipment, and material evaluations and improvements to apply changes at various process steps. Your duties include leading and engaging in activities to improve yield and reduce costs, overseeing new process baseline qualifications, and collaborating with suppliers to achieve quality, cost, and risk objectives. You will use AI/ML/LLM tools to boost efficiency and maintain flawless operations. Responsibilities include, but not limited to: • Develop and optimize wafer bonding processes to enable next-generation DRAM technologies. • Plan and execute experiments (DOEs) to improve process performance, product quality, and reliability. • Drive yield improvement, cost reduction, and productivity initiatives using data-driven problem solving. • Evaluate and qualify new equipment, materials, and process technologies for development and manufacturing. • Collaborate with manufacturing, suppliers, and cross-functional teams to resolve issues and implement process improvements. • Use advanced analytics, AI/ML tools, and technical expertise to solve complex problems and accelerate innovation. Minimum Requirements: • PhD with 3+ years, Master's degree with 5+ years, or Bachelor's degree with 7+ years of relevant semiconductor industry experience. • 5+ years of experience developing and driving wafer bonding technologies, process integration, or related semiconductor manufacturing processes. • Hands-on experience with one or more of the following: direct bonding, hybrid bonding, wafer thinning, de-bonding, or other advanced bonding technologies. • Strong analytical and problem-solving skills with a demonstrated ability to lead complex technical challenges, drive innovation, and deliver process improvements through data-driven decisions. • Proven ability to work effectively across cross-functional teams while independently leading projects, influencing technical direction, and delivering results. • Experience developing and optimizing semiconductor processes to improve quality, reliability, yield, cost, and manufacturing readiness. Preferred Requirements: • Experience supporting DRAM, memory, or advanced semiconductor technology development. • Knowledge of process characterization, statistical analysis, DOE methodology, and root-cause investigation techniques. • Experience qualifying new equipment, materials, and process technologies for high-volume manufacturing. • Familiarity with supplier collaboration and technology transfer activities. • Experience using AI, machine learning, or large language models (LLMs) to improve engineering productivity and accelerate problem solving. • Strong written, verbal, and presentation communication skills. Location: • Boise, Idaho Micron benefits include: Health, Savings, Wellbeing Programs, Stock Purchase Discount, and a generous Time Off Program.