ARM

Staff Package Layout Engineer

ARM$209K — $282K *
Technical Services
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • Electrical Engineering degree or equivalent work experience
  • Experience with 2.5D and 3D package systems and their SI/PI requirements
  • 5-7+ years of recent experience in Cadence APD & Allegro toolsets
  • Ability to understand the bigger picture to drive standardization and efficiency
  • Professional demeanor with openness to feedback and continuous learning

Responsibilities

  • Assist in defining, designing, and verifying package designs
  • Create layouts using best-known practices for DFM and DFA
  • Guide and support other team members
  • Coordinate and communicate with external vendors
  • Conduct feasibility studies to evaluate package design goals
  • Optimize package bump-map and ball patterns based on studies
  • Define and test new methodologies for layout team efficiency

Benefits

  • Support for hybrid working to balance performance and personal wellbeing.
  • Accommodations provided during the recruitment process as needed.
Full Job Description
This Engineer will become part of a team responsible for implementing ARM's next generation of SoC's in the IoT, Automotive, and Compute spaces. These complex designs use current and emerging 2.5 and 3D technologies and will require you to work closely with IP, PCB, SI/PI and Systems teams in France, US, UK, and other ARM locations as needed as well as our technology partners.

Responsibilities:

The engineer will assist in the definition, design, and verification of our package designs. Candidate will work closely The candidate needs to be able to adapt to proposed changes as well as propose solutions to loosely defined problems.
  • Layouts using best-known practices for DFM, DFA, Signal and Power Delivery Networks!
  • Provide guidance to other team members
  • Communicate and coordinate with external vendors as needed.
  • Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
  • Optimize package bump-map and ball patterns based on feasibility studies and propose layout design trade-offs to the Technical Package Lead when appropriate.
  • Help implement package routing, stack-up creation, reference plane and power distribution using Cadence APD or SiP tool suite.
  • Help define and test new methodologies that helps improve the efficiency of the layout team.


Required Skills and Experience :

  • An Electrical Engineering degree or equivalent work experience
  • Experience with 2.5D and 3D package systems and their SI/PI requirements
  • 5-7+ years of recent experience in the use of Cadence APD & Allegro toolsets
  • Facilitate standardization by being aware of the bigger picture, including design features which will drive standardization and improve efficiency throughout the department
  • Maintain a professional and positive demeanor while being open to feedback and continuous learning.


"Nice To Have" Skills and Experience :

  • Familiarity with EDA vendor collaboration, tool evaluations, and issue resolution
  • Strong verbal, written communication and presentation skills
  • Programming experience in Python, SKILL, or TCL


Salary Range:

$209,100-$282,900 per year
We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.

Accommodations at Arm

At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email [redacted] . To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.

Hybrid Working at Arm

Arm's approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team's needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.

About ARM

ARM Holdings is a British multinational semiconductor and software design company, owned by SoftBank Group and its Vision Fund. With its headquarters in Cambridge, England, the company designs microprocessors, physical intellectual property (IP) and related technology and software, and sells development tools to deliver complete solutions for the digital world. ARM's technology is used in a wide range of applications, including automotive, consumer electronics, and Internet of Things (IoT) devices. The company was founded in 1990 and has grown to become one of the world's leading semiconductor IP companies.
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