Renesas Electronics America

Staff Package Design Engineer

Renesas Electronics America$100K — $130K *
Consumer Technology
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 4+ years of hands-on experience in Package CAD layout and development.
  • Strong background in 2.5D / 3D IC packaging, FCBGA, and advanced substrate-based packages.
  • High proficiency in Cadence Allegro Package Designer or Siemens Xpedition / Substrate Integrator.
  • Proven experience with advanced manufacturing design rules and interfacing with OSATs and foundries.
  • Solid understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals.
  • Strong communication and documentation skills with a record of success in global teams.

Responsibilities

  • Execute package layout design for advanced packages, including 2.5D/3D IC and multi-chip modules.
  • Develop and maintain package CAD databases, ensuring strict adherence to design guidelines.
  • Manage the complete design cycle from schematic creation to generating manufacturing outputs.
  • Create and modify substrate layouts, bump maps, and power/ground structures.
  • Collaborate with SI/PI, thermal, reliability, and DFT teams for co-optimization.
  • Ensure compliance with foundry and manufacturing design rules.
  • Support design updates and version control throughout the project lifecycle.

Benefits

  • Launch and advance your career across multiple product groups.
  • Make a real impact by developing innovative products.
  • Maximize performance and wellbeing in a flexible work environment.
Full Job Description
Job Description

In this role, you will be at the intersection of silicon design and system implementation. You will play a critical part in designing and delivering next-generation, high-performance packaging solutions; including 2.5D/3D, chiplet-based, FCBGA, SiP, WLCSP, wire bond, and QFP/QFN packages that power our industry-leading automotive SoCs, industrial IoT microcontrollers, and AI-forward computing platforms. This role demands strong technical depth in package layout execution, a deep understanding of manufacturability, and a collaborative mindset for cross-domain co-design with our global silicon, SI/PI, thermal, and reliability teams.

Key Responsibilities
  • Execute package layout design and development for advanced packages, including 2.5D/3D IC, FCBGA, SiP, WLCSP, and multi-chip modules.
  • Develop and maintain package CAD databases, ensuring strict accuracy and adherence to design guidelines, DFM (Design for Manufacturing), and DFA (Design for Assembly) to guarantee high manufacturability and high-yield reliability.
  • Manage the complete design cycle: from schematic creation, netlist import, and footprint assignment to generating manufacturing outputs (Gerbers, drill data, and fabrication/assembly drawings).
  • Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.
  • Collaborate closely with SI/PI, thermal, reliability, and DFT teams to support co-optimization and participate in critical design reviews.
  • Ensure all designs strictly comply with foundry, OSAT, and manufacturing design rules (DRC, LVS).
  • Support Engineering Change Orders (ECO) cycles, design updates, and version control throughout the project lifecycle.


Qualifications
  • 4+ years of hands-on experience in Package CAD layout and development.
  • Strong background in 2.5D / 3D IC packaging, FCBGA, advanced substrate-based packages, and multi-die/chiplet-based designs.
  • High proficiency in industry-standard tools such as Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Substrate Integrator, or equivalent.
  • Proven experience working with advanced manufacturing design rules and interfacing directly with Tier-1 OSATs and foundries.
  • Solid basic understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals, high-speed routing, impedance control, and crosstalk mitigation.
  • Strong communication, presentation, and documentation skills with a proven track record of working effectively in global, cross-functional team environments.

Education
  • Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.


Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose 'To Make Our Lives Easier.' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.

With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, 'To Make Our Lives Easier.'

At Renesas, you can:
  • Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
  • Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people's lives easier, safe and secure.
  • Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?

Join Renesas. Shape Your Future with Us.

Videos To Watch
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About Renesas Electronics America

Renesas Electronics America is a leading supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad range of analog and power devices, with operations spanning research, development, design and manufacturing for a wide range of applications.
Learn more about Renesas Electronics America
Size
2,000 employees
Industry

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