The Principal Mechanical Engineer plays a key role in the design and development of Phantom camera electronics packaging, with a strong focus on ruggedization and thermal management. This position requires deep expertise in mechanical engineering, materials science, and cost-effective manufacturing, along with experience delivering reliable products for demanding environments.
Key ResponsibilitiesDesign & Development
- Lead design of Phantom camera electronics packaging using SolidWorks, ensuring performance, reliability, and cost targets are met
- Design chassis, heat sinks, and related accessories, cables, and support equipment
Rugged Design & Thermal Management
- Develop ruggedized designs for harsh environments (shock, vibration, temperature extremes, moisture)
- Implement effective active and passive thermal management solutions
Materials & Cost Optimization
- Select materials and components balancing performance, durability, and cost
- Partner with procurement and manufacturing to optimize designs for cost-effective production (COGS)
Prototyping & Testing
- Oversee prototyping and validation testing to ensure performance and reliability
- Develop test fixtures as needed
Documentation & Process
- Create detailed engineering documentation, including drawings and ECOs
- Apply configuration control and support product lifecycle management
Collaboration
- Work closely with electrical engineers, product managers, and manufacturing teams to integrate designs
- Drive electro-mechanical tradeoffs to achieve optimal packaging and cooling solutions
Continuous Improvement
- Stay current with industry trends, technologies, and best practices to improve design processes and product performance
Requirements Education & Experience
- Bachelor's degree in Mechanical Engineering; Master's degree preferred
- Minimum 10 years of experience in mechanical engineering, with focus on electronics packaging and rugged design
Technical Expertise
- Proficiency in SolidWorks 3D CAD
- Strong knowledge of GD&T principles
- Experience in electronics packaging, cooling, and cross-functional collaboration (EE/ME teams)
- Demonstrated expertise in thermal analysis and active/passive cooling techniques
- Experience with PLM, configuration control, and ECO processes
- Familiarity with FEA for structural and thermal analysis
- Knowledge of materials selection for rugged applications
- Experience with manufacturing processes (CNC, casting, extrusion, injection molding) and DFM
Professional Skills
- Strong problem-solving skills and attention to detail
- Ability to manage multiple projects and meet deadlines
- Team-oriented with strong work ethic and adaptability
- Familiarity with cost analysis and optimization
CompensationEmployee Type: Salaried
Currency: USD
Salary Minimum: 150,000
Salary Maximum: 200,000
Incentive: No
Disclaimer: Where a specific pay range is noted, it is a good faith estimate at the time of this posting. The actual salary offered will be based on experience, skills, qualifications, market / business considerations, and geographic location.
For more information on AMETEK's competitive benefits, please click here.