Staff Manufacturing Engineer, Advanced Components
We are expanding our team and seeking a talented Manufacturing Engineer to join our innovative Advanced Component Technologies group. In this role, you will be responsible for the development, implementation, and qualification of new supply chain and technology platforms that enable MSEI to meet its product quality, reliability, volume, delivery, and cost objectives.
Your Responsibilities- Define & deploy technology platforms in a cross-functional team for new product applications through testing, simulation and prototypes.
- Qualification of components for use in surface mount electronic manufacturing.
- Use systematic problem-solving approaches to resolve quality/performance issues with suppliers, development, and manufacturing teams.
- Lead testing and validation of components for high reliability applications, by performing use case based electrical and environmental stress tests.
- Implementation tasks including leading stage-gate approvals, documentation, supplier quality interface, characterization, verification and on-going sustaining support in a highly automated manufacturing environment.
- Support new development projects ensuring compliance to internal and industry standards
- Perform failure analysis and drive to root cause supporting production and prototyping
- Engage with internal and external customers on technical topics
- Assess, communicate with key stakeholders, and qualify process changes at suppliers
- Perform on-site supplier audits, domestic and international
Your ProfileEducation / Experience Requirements- B.Sc. or M.Sc in Electrical Engineering, Applied Physics, Material Science, or equivalent physical science, with evidence of high academic achievement
- Excellent written and verbal communications skills; Detail oriented
- 8+ years experience with chip scale packaging, direct bump attach, copper pillar, and similar technologies
- Detailed knowledge of wafer-level packaging, wire bond, encapsulation, and chip attach; their materials and processes.
- Detailed knowledge of IC packaging failure modes and root cause analysis techniques
- Experience in high reliability electronics manufacturing environment
- Experience with quality systems including technical writing of quality-relevant documentation
- Strong physics based reasoning
- Experience with failure analysis and root cause corrective action with suppliers
- Demonstrated ability to conceive, implement and complete engineering projects and experiments on schedule
- Proven leadership skills with ability to coach, mentor, and lead technical staff
- Proficiency in standard office productivity software (Excel, Word, PowerPoint, etc... )
- Demonstrated ability to interface across multiple functions/organizations (Quality, Manufacturing, Supply Chain, Test, Module/System development) to drive closure on projects.
- Demonstrated creativity with multiple examples of innovative solutions. U.S. or EU Patents desirable.
Physical & Travel RequirementsThe physical demands described within this job description are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.
- While performing the duties of this job, the employee is regularly required to be independently mobile.
- The employee is also required to interact with a computer for extended periods of time and communicate with co-workers.
- Must be able to work a minimum of 40 hours / week.
- Must be able to travel internationally and domestically, less than 5% of the time.
Location: Lake Oswego(0001)
Working hours: Full-time
MSEI Lake Oswego Oregon (US-OR) USA
Job ID: 62390
