Role Overviewd-Matrix is seeking an experienced Mechanical Engineer to lead rack-scale mechanical design for our AI inference hardware platform, from chip/package to full system level. In this role, you'll own mechanical systems through their entire lifecycle - from concept and validation to mass production - working closely with thermal, electrical, software, and systems engineering teams. You'll bring deep expertise in OCP (Open Compute Project) specifications, chassis and sheet metal design, and supplier/ODM management to help scale our hardware in a fast-paced startup environment. This is a hands-on role for someone who thrives working across disciplines and can drive mechanical programs from first concept through high-volume manufacturing.
This role owns mechanical systems at the rack, enclosure, and cross-program level, including oversight of liquid-cooled rack architectures. It partners closely with the Card & Sub-Chassis Mechanical Engineer, who owns card-level design and the MCM-to-cold-plate interface within the Monza chassis - this role is not expected to duplicate that card/cold-plate ownership, but should have enough liquid-cooling fluency to review and integrate that work at the rack level.
What You Will Do- Lead mechanical design for our AI inference hardware platform at rack scale, in compliance with OCP specifications.
- Design and validate chassis mechanical systems, sheet metal enclosures, cooling architectures, and high-power connections.
- Own the full product lifecycle - from design and validation through NPI to mass production.
- Conduct mechanical reliability testing (shock, vibration, thermal cycling) and lead 3D modeling, FEA, and tolerance analysis to validate designs for manufacturability.
- Partner with suppliers, ODMs, CMs, and JDMs to develop custom mechanical/thermal components and manage manufacturing support through production ramp.
- Debug and resolve quality issues surfaced during NPI and production, driving root-cause analysis and corrective action.
- Review and sign off on liquid-cooled cold plate and manifold integration at the rack level (design owned by the Card & Sub-Chassis Mechanical Engineer), ensuring compatibility with CDU interfaces and facility water connections.
- Develop specifications and test procedures for reliability and performance and mentor engineers across the design lifecycle.
- Evaluate new technologies and methodologies to improve mechanical and thermal performance and ensure compliance with quality standards through product launch.
What You Will Bring- Bachelor's degree in mechanical engineering or a related field.
- 10+ years of industry experience in mechanical design, simulation, and validation for IT hardware, with demonstrated technical leadership of full rack-scale programs.
- Hands-on experience with OCP specifications and rack-scale system design.
- Strong background in chassis mechanical design, sheet metal design/fabrication, and design-for-manufacturability (DFM) at high volume.
- Experience running and interpreting shock and vibration testing.
- Proven track record taking designs from concept through validation to mass production (NPI to MP).
- Direct experience working with suppliers, ODMs, CMs, and/or JDMs on hardware development.
- Strong debugging and root-cause analysis skills for mechanical/quality issues in production environments.
- Proficiency in CAD tools and FEA.
- Expertise in GD&T and tolerance stack-up analysis, and materials selection for structural and thermal performance in chassis/enclosure design.
- Self-driven and detail-oriented, comfortable working independently or across engineering teams.
Preferred Qualifications- Master's degree in mechanical engineering or related field.
- 15+ years of industry experience in mechanical design, simulation, and validation for IT hardware.
- Experience with data center hardware or high-performance computing systems at scale.
- Familiarity with liquid-cooled rack architectures (cold plates, manifolds, CDUs, facility water interfaces) sufficient to review and integrate card-level cooling designs at the rack level.
- Direct hands-on cold plate or manifold design experience, beyond rack-level integration.
- Deep understanding of reliability testing, failure analysis, and thermal stress modeling for electronic components.
