Sr. Staff Engineer, Package and Interconnect ReliabilityJob Location: On-site in San Jose
Position SummaryWe are seeking a highly skilled and motivated Staff Package and Interconnect Reliability Engineer to lead the reliability qualification and physics-of-failure analysis for our next-generation silicon photonics products. In this role, you will be the core technical authority ensuring the structural, thermal, and optical alignment integrity of highly complex 3D/2.5D IC packaging architectures.
You will work closely with advanced foundry partners (including TSMC) to qualify advanced packaging technologies like COUPE (Compact Optical Engine), micro-bump/hybrid bonding, precision die attach, and critical optical-to-electrical interfaces such as Fiber Array Units (FAUs) and optical connectors.
Key ResponsibilitiesAdvanced Packaging & Heterogeneous Integration Reliability
- Advanced Bonding & Micro-Assembly: Qualify and optimize the reliability of critical wafer-to-wafer and die-to-wafer bonding processes, including Cu-Cu hybrid bonding, micro-bumps, and high-density copper pillars.
- Precision Die Attach: Establish reliability margins and wear-out mechanisms for high-accuracy sub-micron die attach processes utilized for co-packaging lasers (InP/GaAs) and Electronic Integrated Circuits (EIC) onto the Photonic Integrated Circuit (PIC).
- Foundry Collaboration: Partner closely with advanced foundries-specifically TSMC-to evaluate, stress-test, and sign off on advanced packaging platforms like COUPE, CoWoS, and InFO variants tailored for optical engines.
Optical Interconnect & FAU Reliability
- Fiber Array Unit (FAU) Integration: Drive reliability qualification for the optical interface, specifically addressing epoxy degradation, glass/silicon sub-mount stability, and the mechanical retention of FAUs over lifetime environmental stressors.
- Optical Connectors: Own the qualification of next-generation pluggable and co-packaged optical connectors. Evaluate insertion/extraction cycling, dust contamination vulnerabilities, and mating force effects on optical alignment stability.
- Sub-Micron Alignment Stability: Define test strategies to monitor and mitigate sub-micron sub-component shifting under extreme thermal cycling (TCT), high-temperature storage (HTSL), and biased damp heat testing.
Failure Analysis & Physics of Failure (PoF)
- Root Cause Analysis: Drive deep-dive Failure Analysis (FA) on components that fail during reliability stress testing using advanced techniques (e.g., CSAM, High-resolution X-ray, SEM/EDX, FIB, and optical interferometry).
- Thermo-Mechanical Modeling Interaction: Collaborate with FEA (Finite Element Analysis) teams to evaluate the impacts of CTE (Coefficient of Thermal Expansion) mismatches between optical elements, substrates, and optical epoxies.
- Mitigation Strategies: Provide actionable feedback to Design for Excellence (DFX), Package Design, and Process teams to mitigate risks like electromigration, thermo-mechanical fatigue, creep, and interfacial delamination.
Required Qualifications- Education: BS in Materials Science, Microelectronics, Mechanical Engineering, Optical Engineering, Physics, or a related discipline.
- Experience: 6+ years of hands-on experience in semiconductor packaging reliability, with a strong focus on advanced 2.5D/3D heterogeneous packaging or optoelectronic components.
- Optical Assembly Expertise: Deep understanding of optical assembly methods, including passive/active alignment, FAU attach architectures, high-performance optical epoxies, and precision optical connectors.
- Foundry & Process Knowledge: Direct experience working with advanced packaging foundries or OSATs. Familiarity with wafer-level micro-bump assembly, die attach parameters, and advanced integration technologies like TSMC COUPE is highly desirable.
- Reliability Knowledge: Strong grasp of semiconductor and optoelectronic reliability statistics (Weibull, Lognormal distributions, acceleration factors) and industry standards (JEDEC, Telcordia GR-468, MIL-STD).
Preferred Skills & Attributes
- Education: Master's or Ph.D. in Materials Science, Microelectronics, Mechanical Engineering, Optical Engineering, Physics, or a related discipline.
- Experience evaluating the long-term aging behavior, outgassing, and UV/Thermal curing profiles of optical polymers and adhesives.
- Familiarity with laser-diode reliability and high-power density optical facet damage mechanisms.
- Excellent cross-functional communication skills, with the ability to bridge the gap between silicon design, mechanical package design, and optical system engineers.
- A thrive-in-the-ambiguity mindset typical of fast-paced, cutting-edge technology development.
Salary Range: $180,000 - $223,000
NOTE TO RECRUITERS:
Principals only. We are not accepting resumes from recruiters for this position. Remuneration for recruiting activities is only applicable subject to a signed and executed agreement between the parties. Please don't send candidates to Ayar Labs, and do not contact our managers.
