Application close date:

Blue Origin is pioneering the future of space-based communications with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This multi-orbit constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity for critical operations worldwide.

Blue Origin is seeking a Signal Integrity (SI) Engineer to develop next‑generation high‑speed digital and RF systems, including advanced optical and RF interconnects. You will own end‑to‑end channel design and validation—from simulation and modeling through PCB stackup definition, calibration structures, and lab characterization up to ~70GHz.

Key Responsibilities:

• Signal integrity ownership Lead SI analysis for high‑speed serial links and RF interconnects up to ~70GHz.

• 3D EM simulation Use HFSS to model interconnects, packages, transitions, and antenna‑adjacent structures.

• Circuit/channel simulation Use ADS for linear/nonlinear circuit modeling, S‑parameter work, and trade studies.

• IBIS‑AMI modeling Build, adapt, and correlate IBIS‑AMI models with measurements and full‑wave simulations.

• High‑speed PCB architecture Define stackups, materials, impedance targets, and routing rules for SI‑robust designs.

• Calibration and de‑embedding Design SOLT/TRL structures, coupons, and procedures for VNA/TDR workflows.

• Hardware characterization Measure and correlate S‑parameters, loss, isolation, and channel performance across simulation and hardware.

• Root‑cause analysis Diagnose and resolve SI issues including reflections, resonances, crosstalk, and mode conversion.

• Documentation and communication Produce clear reports, guidelines, and review material for cross‑functional teams.

Basic Qualifications:

• Bachelors degree in Electrical/Electronics Engineering or related field.

• 5+ years in SI, high‑speed digital, or RF/microwave design.

• Proficiency with HFSS, ADS, and IBIS‑AMI workflows.

• Experience defining PCB stackups for high‑speed/microwave designs.

• Hands‑on VNA/TDR measurement experience.

• Strong understanding of transmission lines, S‑parameters, loss mechanisms, jitter, crosstalk, and channel budgeting.

• Ability to work across RF, digital, packaging, and systems teams.

Preferred Qualifications:

• Masters degree in EE or related field.

• Experience designing or characterizing channels/interconnects up to ~70GHz.

• Background in antenna‑adjacent PCB design (arrays, feed networks, front‑end modules).

• Experience with package‑to‑PCB co‑design.

• Familiarity with scripting (Python, MATLAB) for SI automation.

• Experience correlating BER/margin results to SI simulations.

• Exposure to space/aerospace hardware and reliability constraints.

Additional Requirements

• Must be a U.S. person (U.S. citizen or permanent resident) as required by applicable export control laws.

• Willingness to support occasional off‑hours testing or lab work as project schedules require."

Base Pay Range for:

Other site ranges may differ

Benefits

• Benefits include:  Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
• Stock Options for all regular employees (working at least 20 hours/week)
• Paid Time Off:  Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.
• Dependent on role type and job level, employees may be eligible for benefits and bonuses based on the companys intent to reward individual contributions and enable them to share in the companys results, or other factors at the companys sole discretion. Bonus amounts and eligibility are not guaranteed and subject to change and cancellation. Please check with your recruiter for more details.