Qorvo, Inc

Sr. Process Integration Engineer, SAW R&D

Qorvo, Inc$100K — $130K *
Telecommunications & Hardware
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • PhD in Physics, Material Science & Engineering or related fields
  • Coursework in MEMS or thin films integration for acoustic devices is a plus
  • Experience in semiconductor/MEMS industry as a process integration/technology development engineer
  • Strong communication skills to present information effectively
  • Experience in developing/transferring processes from R&D to high volume manufacturing
  • Familiarity with semiconductor processing techniques (PVD, CVD, lithography, etch, CMP)
  • Programming skills in MATLAB or Python are advantageous

Responsibilities

  • Provide MEMS and thin films process integration support
  • Develop and transfer processes from R&D to high volume semiconductor manufacturing
  • Support process engineering, design engineering, and manufacturing teams
  • Provide assistance for SAW resonators on bonded wafer substrates
  • Work in a wafer level packaging environment

Benefits

  • Collaborative and innovative work culture
  • Opportunity to work on cutting-edge technology development
  • Direct involvement in enhancing device performance and diversifying product portfolio
  • Chance to lead projects from R&D to production
  • Access to continuous learning and professional development opportunities
Full Job Description
Job Title: Sr. Process Integration Engineer, SAW R&D

SUMMARY:

Our SAW R&D team seeks a Sr. Process Integration Engineer to focus on new technology development. In our ongoing effort to improve device performance and diversify our product portfolio, we need a creative person who can integrate complex fab processes. The ideal candidate is a technical person, who finds solving challenging problems to be a rewarding task.

RESPONSIBILITIES:
  • The candidate will provide MEMS, thin films process integration support to include developing and transferring processes from R&D to high volume semiconductor manufacturing environment.
  • The candidate will support process engineering, design engineering and manufacturing teams.
  • Provide support for SAW resonators on bonded wafer substrates in a wafer level package.


QUALIFICATIONS:
  • PhD in Physics, Material Science & Engineering or related fields.
  • Coursework in MEMS, thin films integration or thin films for acoustic devices is a plus
  • Experience in semiconductor/MEMS industry as a process integration / technology development engineer
  • Will leverage strong communication skills to present information as needed to peers and others within the organization
  • Experience in developing/transferring processes from R&D to high volume manufacturingKnowledge of the various standard semiconductor processing techniques (PVD, CVD, lithography, etch, CMP), hands-on experience being a plus
  • Prior SAW / acoustic devices experience is a plus
  • Knowledge in acoustics for thin films materials or material physics is a plus
  • Skills in programming languages such as MATLAB or Python is a plus


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About Qorvo, Inc

Qorvo, Inc is a semiconductor company that designs, manufactures, and supplies radio frequency (RF) solutions for smartphones, tablets, wireless infrastructure, defense and aerospace applications, and Internet of Things (IoT) applications. The company's products include amplifiers, filters, switches, and integrated modules that support a range of wireless communications standards. Qorvo was formed in 2015 as a result of the merger between RF Micro Devices and TriQuint Semiconductor. The company is headquartered in Greensboro, North Carolina.
Learn more about Qorvo, Inc
Size
8,900 employees
Market Cap
$9.1 billion
Industry
Net Income
$485.2 million
Founded
2013
5 Year Trend
+8.9%
Revenue
$3.7 billion
NASDAQ

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