Job DescriptionJob Summary:Under the general supervision of the Process Engineering Manager, coordinates and directs development and integration of cross module processes and equipment sets. Responsible for new product/process introduction & integration (NPI) spanning wafer epitaxial growth through final sensor test.
Defines processing or handling equipment requirements and specifications, and reviews front & backend processing techniques and methods applied in the manufacture, fabrication, and evaluation of III-V semiconductor sensor devices.
The work is varied, and challenging creative problem-solving opportunities are many. Our culture is collaborative, supportive, and fun.
Detailed Description:- Participate in technology advancement for engineering wafer and/or focal plane array fab processes including photolithography, dry and wet etch, passivation, evaporative deposition, thin film coatings and/or anneal, hybridization, thinning, and/or characterization, for the next generation of infrared detector designs.
- Design, execute, and status production and development experiments. Present technical findings to key stakeholders. Formal DOE creation, execution, and analysis is a plus.
- Apply structured problem solving (Kepner Tregoe, DMAIC, 8D, etc.) to address process/equipment excursions, capacity constraints, and yield improvements.
- Hands on familiarity w/ optical microscopy, surface profiling (interferometry, AFM, etc), ellipsometry, sheet resistance, SEM/FIB, SIMS/XPS, and film stress.
- Experience using MES systems in a medium volume, high mix, semiconductor manufacturing environment.
- Demonstrated understanding of material/chemical safety data and ability to follow safety protocols & regulations.
- Experience w/ phase gate release methodologies (NPI, phased LRIP, PFMEA, control plan, or equivalent)
- Engage external vendors to specify, evaluate, and justify capital processing and metrology equipment. Facilitate gated release into production.
Requirements- B.S. or equivalent in a science or a related field, M.S. or PhD preferred
- Direct experience w/ SQL, Python, JMP, and MATLAB
- Min. 2 years of direct semiconductor processing experience
- Clear verbal and written communication
- Strong working knowledge of semiconductor device physics, infrared detector preferred
- Ability to work in a cleanroom environment wearing full coverall garments for extended periods
- Must be US Citizen or PERM Resident
What We Offer- Competitive Salary & Benefits Package
- Health, Dental, Vision, and Life Insurance starting Day 1
- Paid Vacation, Sick Time, and Holidays
- 401(k) with Company Match
- Employee Stock Purchase Plan
- Tuition Reimbursement for Education
- Fun Employee Events throughout the year
Salary Range: $113,600.00-$151,400.000
Pay TransparencyThe anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
