Job Details:
Job Description:
We seek an exceptional Senior Principal Engineer to lead the overarching photonics product architecture for silicon photonics AI connectivity solutions, with particular focus on Optical Computer Interconnect (OCI) and Co-Packaged Optics (CPO) die-stack solutions. As our Senior Principal Engineer, you will drive delivery of photonics solutions meeting the strategic technical vision for next-generation AI infrastructure connectivity, working with cross-functional teams to deliver breakthrough photonic products that enable massive AI compute scaling. This role offers the unique opportunity to design AI connectivity solutions by defining system-level product architectures that enable unprecedented AI compute density and performance, drive strategic technology roadmaps by engaging in Intel's Silicon Photonics strategy for AI infrastructure, lead technical excellence across domains by orchestrating seamless integration between photonic components, electronic interfaces, thermal management, packaging and AI system requirements, and pioneer next-generation solutions by spearheading development of novel architectures including 112Gbaud+ connectivity, advanced multi-wavelength systems, and innovative packaging approaches for AI workloads.
Qualifications:
Minimum Qualifications:
• PhD in Electrical Engineering, Physics, Optical Engineering, or similar discipline with 8+ years of experience in a related field and 8+ years of relevant industry experience
• 8+ years of experience in silicon photonics system architecture and integration from concept to high volume manufacturing
• Extensive (10+ years) experience in designing and architecting photonic systems for high-performance computing or AI applications
• Proven track record of leading complex, multi-disciplinary technical programs involving photonic systems
• Deep expertise in optical interconnect architecture
• Strong background in AI/ML infrastructure requirements and compute interconnect scaling challenges
• Experience with system-level modeling and/or performance optimization for high-bandwidth optical links
• Demonstrated technical leadership experience directing the work of senior engineering teams
• Cross-functional collaboration skills: working with AI hardware, process, test, packaging, and applications teams
• Executive communication abilities: presenting strategic technical vision to senior leadership and external partners
• Strategic problem-solving mindset: demonstrated ability to architect solutions for complex system-level challenges
Preferred Qualifications
• Technical leadership experience: leading large, multi-site engineering organizations
• Deep experience with AI training and inference infrastructure requirements (GPU clusters, distributed computing)
• Knowledge of advanced packaging technologies for high-density optical interconnects
• Experience with industry standards development (OIF, IEEE, OCP) for optical interconnects
• Familiarity with foundry/fab ecosystems and supply chain management for photonic solutions
• Publications in peer-reviewed journals on optical interconnects or AI infrastructure
• Customer-facing experience with hyperscale data center operators and AI companies
• Exposure to: advanced modulation formats, wavelength division multiplexing (WDM), optical switching architectures, thermal management for high-density optics
• Experience with co-design methodologies linking photonic hardware with AI software stacks
• Knowledge of emerging technologies: linear-drive modulators, advanced detector arrays, optical switching matrices
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
Virtual US
Additional Locations:
Business group:
At the Data Center Group (DCG), we're committed to delivering exceptional products and delighting our customers. We offer both broad-market Xeon-based solutions and custom x86-based products, ensuring tailored innovation for diverse needs across general-purpose compute, web services, HPC, and AI-accelerated systems. Our charter encompasses defining business strategy and roadmaps, product management, developing ecosystems and business opportunities, delivering strong financial performance, and reinvigorating x86 leadership. Join us as we transform the data center segment through workload driven leadership products and close collaboration with our partners.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $256,050.00-361,480.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. However, you must live and work from the country specified in the job posting, in which Intel has a legal presence. Due to legal regulations, remote work from any other country is unfortunately not permitted. * Job posting details (such as work model, location or time type) are subject to change.The application window for this job posting is expected to end by 07/06/2026
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
