SoC Interconnect and Fabric RTL Designer

TylSemi

$130K — $180K *
Consumer Technology
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • BS/MS in Electrical or Computer Engineering with 8+ years in digital IC design
  • 4+ years leading on-chip interconnect or bus fabric architecture
  • Expertise in on-chip interconnect protocols such as AXI4 and CHI
  • Experience with Network-on-Chip (NoC) design
  • Familiarity with AMBA integrities and their design implications
  • Strong proficiency in SystemVerilog for hardware design
  • Knowledge of static timing constraints for multi-clock designs

Responsibilities

  • Define on-chip fabric topologies for subsystem connectivity
  • Specify high-bandwidth data-path strategies and buffering methods
  • Architect register-access fabric with access-protection logic
  • Define arbitration and QoS policies for shared resources
  • Develop fabric error-handling architecture and management systems
  • Manage CDC strategy across clock-domain boundaries
  • Oversee all fabric RTL and on-chip interconnect components
  • Drive integration assembly, maintaining top-level netlist accuracy
  • Coordinate with subsystem leads on interface protocols
  • Establish fabric-level tests for system integrity checks
  • Collaborate with physical design on impacts to fabric floorplan

Benefits

  • Flexible hybrid work environment
  • Career advancement opportunities in cutting-edge AI technology
  • Chance to work on high-performance computing projects
  • Access to professional development resources
  • Collaboration with top-tier engineering teams
Full Job Description
We are looking for System On-chip/SoC Fabric micro-architect and designer for chiplet-based AI and High-Performance Compute silicon development.

What You'll Do

  • Define on-chip fabric topologies connecting the multiple subsystems
  • Specify the data-path fabric for the high-bandwidth routes: bandwidth provisioning, pipeline depth, buffering strategy, and back-pressure propagation between major subsystems.
  • Architect the register-access fabric with address decoding and access-protection logic.
  • Define the arbitration and QoS policy for shared fabric resources: priority assignment per traffic class, bandwidth reservation, and starvation-prevention mechanisms.
  • Own the fabric error-handling architecture: how illegal accesses, timeouts, and protocol violations are detected, logged, and reported to the management subsystem.
  • Own the CDC strategy for every clock-domain boundary on the die - and documenting the timing constraints for each.
  • Own or closely review all fabric RTL: bus bridges, async FIFOs, arbiters, address decoders, and pipeline registers that form the on-chip interconnect.
  • Drive integration assembly: own the top-level connectivity netlist that instantiates all major blocks and wires them through the fabric, serving as the integration point of truth.
  • Coordinate with subsystem leads align on interface protocols, handshake semantics, and reset sequencing at each fabric boundary.
  • Define and own the fabric performance model: estimate bandwidth utilization per path under representative traffic mixes for each operating mode and identify bottlenecks.
  • Establish fabric-level bring-up tests: register accessibility checks, path connectivity tests, and loopback sequences that confirm the interconnect is healthy before full subsystem integration testing begins.
  • Coordinate with the physical design team on fabric floorplan implications: block placement driven by dominant data flow, clock-region boundaries, and wire-length budgets for timing closure.


WhatWe're Looking For

  • BS/MS in Electrical Engineering, Computer Engineering, or equivalent with 8+ years of digital IC design, with at least 4 years owning on-chip interconnect, bus fabric, or NoC architecture at block-lead or integration-lead level.
  • Deep expertise in one or more on-chip interconnect protocols: AXI4 / AXI4-Lite / AXI-Stream; CHI or equivalent; able to write and review bus bridge RTL and understand ordering rules, response channels, and error signaling.
  • Experience with Network-on-Chip (NoC) design or integration of commercial NoC IP (in a complex SoC).
  • Familiarity with AMBA CHI or ACE coherency extensions and their impact on fabric design.
  • Solid understanding of CDC design: async FIFO design, gray-code counters, synchronizer topologies, and CDC verification methodology.
  • Experience owning the top-level integration netlist or chip-level assembly RTL on a multi-block design.
  • Strong SystemVerilog skills: arbiters, FIFOs, pipelines, address decoders, and parameterized bus infrastructure.
  • Experience with static timing constraints for multi-clock designs


Good To Have

  • Background with high-speed chiplet or SoC integration at advanced nodes (7 nm or below), including floorplan-driven bus topology decisions.
  • Experience building or maintaining an automated register-map generation flow (SystemRDL, IP-XACT, or similar).
  • Prior role as chip-level integration lead responsible for assembling subsystem IPs into a complete design.
  • Familiarity with hardware security primitives: access control, firewall IP, or trusted execution region isolation in the fabric.
  • Experience with formal property verification of bus protocols or CDC crossings.


Location

Hybrid/On-site - San Jose, CA / Remote -USA

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