Summary of Role:GlobalFoundries Advanced Packaging Lab is seeking an accomplished engineer with extensive expertise in chiplet-based system integration, specifically within 2.5D interposer/bridge and 3D heterogeneous integration technologies. This senior technical position entails end-to-end integration responsibility for advanced heterogeneous solutions, encompassing silicon, glass, and mold interposers as well as embedded silicon bridge architectures.
Essential Responsibilities:- Lead 2.5D/3D advanced packaging technology platforms (e.g. silicone/glass/mold interposer, silicon bridge, deep trench capacitor, etc.) integration strategy and readiness, including interface requirements and co-optimization with fabrication and assembly constraints.
- Partner with cross-functional teams such as unit process engineers, modeling engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.
- Collaborate joint development projects with partners to develop 2.5D/3D Heterogeneous Integration processes and to provide timely updates on schedule and deliverables
- Drive end-to-end process integration, interpretation of results and planning to enable new capabilities and early product prototyping across multiple programs.
- Own integration risk assessment and develop reliability strategy; drive root-cause investigation of failure modes through failure analysis and structured design of experiment.
- Promote technical innovation via patents, internal publications, and robust integration methodologies for 2.5D/3D heterogeneous integration-including silicon/glass interposer, silicon bridge, advanced interconnects, and comprehensive integration control and metrology.
Other Responsibilities: - Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
- Participate in hiring activities.
- Mentor and guide new hires to assume their roles and responsibilities.
- Other duties as assigned by manager.
Required Qualifications: - Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or related field from an accredited degree program.
- MS degree with at least 10 years of prior related work experience.
- In-depth knowledge of BEOL processes and advanced packaging integration, including RDL/UBM metallization, wafer thinning/backside processing, wafer test/probe, OSAT collaboration, and package development & assembly.
- Strong problem-solving and technical troubleshooting skills, including expertise in design of experiment, statistical analysis, and yield/reliability learning.
- Demonstrated record of technical leadership, strong execution, and ability to influence across functions (fab, design, product engineering, reliability, and external partners).
- Language Fluency - English (Written & Verbal).
- Travel - Up to 10%.
Preferred Qualifications: - Education - PhD education level preferred with at least 8 years of prior related work experience.
- Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
- Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning & organizational skills.
Expected Salary Range$118,000.00 - $210,000.00
The exact Salary will be determined based on qualifications, experience and location.
