Application close date:
Applications will be accepted on an ongoing basis until the requisition is closed.

Blue Origin is pioneering the future of space-based communications with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This multi-orbit constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity for critical operations worldwide.

We are seeking a Senior Structural Analyst - Electronics Packaging to serve as the structural analysis owner for one or more TeraWave satellite Line Replaceable Units, LRUs, avionics enclosures, or electronics assemblies. In this role, you will hold end-to-end responsibility for the structural integrity of assigned hardware - from requirements definition and packaging concept through detailed analysis, environmental test, qualification, and production release.

You will own the analysis of electronic boxes, card cages, printed circuit board assemblies, connectors, mounting features, fasteners, brackets, chassis, and internal retention features subjected to launch, handling, test, and on-orbit environments. You will work closely with mechanical design, electrical engineering, thermal engineering, manufacturing, test, and systems teams to ensure each LRU is robust, lightweight, producible, and ready for high-rate constellation deployment.

Responsibilities (include but are not limited to):

• Own structural analysis for TeraWave satellite LRUs, avionics enclosures, electronics assemblies, and power electronics from concept through qualification and production release.

• Analyze electronics packaging hardware, including chassis, covers, mounting interfaces, card guides, wedge locks, fasteners, brackets, connectors, PCBAs/CCAs, and internal supports.

• Build and maintain detailed FEA and simplified analytical models using NASTRAN, ANSYS, Abaqus, or equivalent tools.

• Verify strength, stiffness, modal response, vibration, shock, fatigue, thermal-mechanical performance, and load paths using FEA and classical methods such as Steinberg or Engelmaier.

• Define structural environments, assumptions, boundary conditions, and interface loads with structures, systems, design, and test teams.

• Assess margins of safety for enclosures, bolted joints, inserts, card retention features, solder joints, components, connectors, and mounting feet.

• Support packaging trades for mass, stiffness, manufacturability, access, connector placement, card retention, and robustness.

• Partner with mechanical design engineers to drive structural requirements into enclosure design, PCB layout, component placement, and mounting strategy.

• Maintain structural interfaces, ICDs, analysis plans, model documentation, and verification artifacts.

• Define structural test requirements and support qualification/acceptance testing, including vibration, shock, sine burst, modal, and environmental campaigns.

• Correlate models to test data, investigate anomalies, and recommend design or process improvements.

• Review supplier analyses and test data for compliance with Blue Origin and TeraWave requirements.

• Author analysis reports, margin summaries, test plans, test reports, and certification documentation.

• Present analysis results, risks, and recommendations at design, qualification, and production readiness reviews.

• Mentor junior analysts and design engineers in electronics packaging analysis methods.

• Develop repeatable analysis methods, templates, and allowables for high-rate satellite production.

Minimum Qualifications

• Bachelor's degree in Mechanical, Aerospace, Structural Engineering, or related field.

• 8+ years of structural analysis experience with aerospace, spacecraft, launch vehicle, defense, or high-reliability hardware.

• Experience analyzing avionics, electronics packaging, enclosures, LRUs, PCBAs, or similar hardware for vibration, shock, and thermal environments.

• Proficiency with FEA tools such as NASTRAN, ANSYS, Abaqus, FEMAP, HyperMesh, or equivalent.

• Strong knowledge of classical structural analysis, including bolted joints, fasteners, brackets, plates, beams, inserts, load paths, margins, and fatigue.

• Experience with dynamic environments, including modal, random vibration, sine vibration, and shock.

• Experience supporting qualification or acceptance testing, including planning, instrumentation, data review, model correlation, and anomaly resolution.

• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Preferred Qualifications

• Master's or PhD in Mechanical, Aerospace, Structural Engineering, or related field.

• 10+ years in spacecraft, satellite, launch vehicle, or high-reliability electronics packaging structural analysis.

• Experience owning structural analysis for avionics enclosures, electronics LRUs, RF units, payload electronics, or similar flight hardware through qualification and production release.

• Experience with PCB/CCA vibration analysis, component lead stress, solder fatigue, and electronics survivability methods such as Steinberg or Engelmaier.

• Knowledge of spacecraft environmental requirements and qualification standards, including vibration, shock, TVAC, thermal cycling, and EMI/RFI considerations.

• Familiarity with Bruhn, Roark's, Shigley, Marks', NASA standards, AIAA guidance, or equivalent references.

• Experience with fatigue, fracture mechanics, cumulative damage, or life assessment.

• Experience with thermal-structural analysis, CTE mismatch, and thermal cycling effects in electronics packaging.

• Knowledge of spacecraft enclosure materials, including aluminum, magnesium, titanium, composites, inserts, coatings, and thermal interface materials.

• Experience supporting high-rate production with analysis methods optimized for repeatability, producibility, and cost.

• Experience with CAD/PLM tools such as Creo, Windchill, NX, SolidWorks, Teamcenter, or equivalent.

• Scripting experience with Python, MATLAB, VBA, or similar for automation, data processing, or model generation.

• Hands-on experience with aerospace hardware fabrication, assembly, test setup, or failure investigation.
• Ability to collaborate across design, electrical, thermal, manufacturing, systems, and test teams.
• Strong written and verbal communication skills, including analysis reports, verification documents, and test plans.

• Experience mentoring engineers, leading technical reviews, or establishing analysis best practices.

Base Pay Range for:
CO applicants is $133,500.00 - $186,898.95WA applicants is $145,188.00 - $203,263.20

Other site ranges may differ

Culture Statement

Don't meet all desired requirements? Studies have shown that some people are less likely to apply to jobs unless they meet every single desired qualification. At Blue Origin, we are dedicated to building an authentic workplace, so if you're excited about this role but your past experience doesn't align perfectly with every desired qualification in the job description, we encourage you to apply anyway. You may be just the right candidate for this or other roles.

Benefits

• Benefits include: Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
• Stock Options for all regular employees (working at least 20 hours/week)
• Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.
• Dependent on role type and job level, employees may be eligible for benefits and bonuses based on the company's intent to reward individual contributions and enable them to share in the company's results, or other factors at the company's sole discretion. Bonus amounts and eligibility are not guaranteed and subject to change and cancellation. Please check with your recruiter for more details.