Silicon Photonic Packaging & Process Engineer

The Opportunity:

As a Principal Silicon Photonic Packaging & Process Engineer, you will lead the development and scaling of precision opto-mechanical assembly processes. You will work closely with photonics, mechanical, and test teams to translate design concepts into R&D builds then into repeatable production processes. You will also partner with our contract manufacturers to qualify lines, improve yields, and drive continuous process improvements.

This is a unique opportunity to take ownership of critical opto-mechanical and electronic assembly processes that define the precision, yield, and quality of Voyant's LiDAR modules. You will establish new package designs focused on robust, high-yield manufacturing processes, optimize production at our global contract manufacturers, and help scale complex, high-precision processes from R&D to high-volume production. Your work will directly impact Voyant products, accelerating time-to-market, reducing cost, and ensuring consistent product quality across global manufacturing sites.

This position requires willingness to travel up to 25% domestically and internationally, both within the United States and internationally (primarily Europe and Asia), to support process transfer, line qualification, and build execution at our manufacturing partners.

Key Responsibilities

Package Design:

Familiarity with various packaging technologies including organic and ceramic substrates. Wafer level packaging and 2.5D/3D assembly processes as well as those listed below. Identifying and initiating business with substrate suppliers and assembly houses. Working through the design process mechanically, thermally and electrically to create the optimal solution while staying within supplier manufacturing capabilities. Creating CAD models for simulation and performing simulations to verify designs prior to release.

Precision Lens Assembly:

Own process definition and control for automated microlens alignment and bonding. Program motion sequences, optimize camera and vision-based routines, and tune process parameters (alignment offsets, bonding dwell, UV cure profiles, placement forces) to achieve sub-micron accuracy and high yield.

Die Placement Process Ownership:

Define and maintain process parameters for high-precision die-attach and placement equipment. Drive correlation between pick-and-place accuracy, epoxy flow, and bond-line thickness for consistent optical coupling.

Epoxy and Adhesive Dispense Control:

Establish and control parameters for automated dispense systems. Develop dispense recipes controlling needle diameter, pressure, time, temperature, and material conditioning. Characterize cure profiles and shrinkage impacts on optical alignment stability.

Yield and DOE Execution:

Design and execute structured DOEs to characterize process sensitivity and optimize yield. Use statistical methods to quantify variability and identify dominant factors affecting alignment accuracy, void formation, or optical loss.

Reliability and Qualification:

Familiarity with microelectronics and photonics reliability and qualification standards such as Telecordia, JESD47 and AEC-Q. Also able to lead Root Cause Corrective Actions (RCCAs) with suppliers, Design and Process FMEA's and DOE planning.

Measurement and GR&R:

Define measurement methods and run GR&R studies on critical parameters (e.g., placement accuracy, epoxy volume, bond-line thickness). Ensure metrology tools and data systems at the CM are calibrated and controlled.

Factory Execution and Scale-Up:

Lead the implementation of robotics, automation, and material handling solutions by partnering with automation suppliers and contract manufacturers to enable scalable, high-throughput production. Drive failure analysis (FA) and corrective actions (CA) on process-related issues, and continuously improve yield, throughput, and takt time. Partner with the contract manufacturer to qualify processes, train operators, and own line readiness for precision optical assembly builds.

Qualifications:

• BS or MS in Mechanical, Manufacturing, Photonics, or Electrical Engineering (or equivalent experience)

• 10+ years hands-on experience in semiconductor, photonics packaging, or precision opto-mechanical assembly environments

• CAD modeling and simulation, SolidWorks preferred experience

• Deep familiarity with automated alignment and die-attach systems

• Strong understanding of adhesive dispense physics (viscosity, wetting, cure shrinkage) and related automation equipment

• Proficiency with DOE methods, SPC, and Minitab (or equivalent tools)

• Demonstrated experience working with automation solution providers and contract manufacturers to transfer and adapt prototype processes into high-volume production

• Excellent problem-solving skills and ability to collaborate across mechanical, optical, and test teams

• Willingness to travel up to 25% domestically and internationally

Preferred Qualifications:

• Experience with automated micro-optics or fiber alignment processes

• Experience in standard optics alignment and assembly for lens-to-PIC coupling

• Familiarity with standard micro-electronic assembly (die attach, wire bond, hermetic lid seal, PCBA/SMT)

• Understanding of cleanroom protocols and ESD control best practices

• Familiarity with ISO 9001 process control or automotive-style production quality systems

• Understanding of photonic packaging materials (epoxies, UV adhesives, underfills) and their environmental stability

• Background in precision metrology systems (e.g., digital microscopes, interferometers, or confocal profilers)

• Experience with Finite Element Analysis for both mechanical and thermal simulations