As a
Senior Engineer, Global Product Management within ASM's
Advanced Packaging business, you will play a critical role in shaping the technologies that enable next-generation semiconductor devices. This position offers a unique opportunity to work at the intersection of product strategy, technology development, and customer engagement, helping drive innovations in advanced packaging, heterogeneous integration, chiplet architectures, and next-generation interconnect solutions.
You will collaborate closely with leading semiconductor manufacturers, OSATs, IDM customers, and cross-functional teams across R&D, engineering, operations, and sales to define and commercialize differentiated solutions that address the rapidly evolving advanced packaging market. This role is ideal for a technically strong, customer-focused individual who enjoys translating market needs into successful products and business growth.
Key Responsibilities- Product Lifecycle Management: Lead advanced packaging product platforms from concept through commercialization, high-volume manufacturing, and end-of-life, ensuring alignment with customer roadmaps and business objectives.
- Technology & Product Roadmap Development: Define and maintain product roadmaps that support emerging advanced packaging applications, including hybrid bonding, chiplets, 2.5D/3D integration, HBM, wafer-to-wafer and die-to-wafer processes.
- Product Definition & Configuration Management: Own product requirements, configurations, and platform options to address diverse customer manufacturing requirements while maintaining operational efficiency.
- Customer Engagement & Voice of Customer: Develop strategic relationships with leading semiconductor manufacturers, foundries, and OSATs to understand technology requirements, future packaging trends, and competitive positioning.
- Market Requirements Specification (MRS): Develop and manage comprehensive market and product requirement documents aligned with customer technology roadmaps and market inflection points.
- Strategic Marketing & Business Development: Drive market assessments, TAM analysis, customer segmentation, competitive benchmarking, and go-to-market strategies to support business growth.
- Financial & Business Analysis: Partner with finance and business leadership to evaluate investment opportunities, develop business cases, and assess product profitability using NPV, IRR, and ROI methodologies.
- Market Intelligence & Competitive Analysis: Monitor advanced packaging industry trends, competitor activity, customer technology roadmaps, and emerging market opportunities.
- New Product Introduction (NPI): Lead the business planning and market readiness activities for new product launches, including customer adoption strategies, positioning, and value proposition development.
- Cross-Functional Technology Leadership: Collaborate with R&D, engineering, applications, and operations teams to prioritize product development efforts and ensure alignment with customer requirements.
- Strategic Ecosystem & Supplier Engagement: Build partnerships with key materials suppliers, technology partners, research institutes, and industry consortia to support technology development and market adoption.
- Industry Presence & Product Promotion: Represent ASM at industry conferences, customer events, and technology forums; develop product messaging, technical presentations, and sales enablement materials.
Requirements- 5-10 years of experience in product management, technical marketing, applications engineering, process engineering, or business development within the semiconductor industry.
- Master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Mechanical Engineering, or a related technical field.
- Strong understanding of advanced packaging technologies, including heterogeneous integration, chiplet architectures, hybrid bonding, wafer-level packaging (WLP), panel-level packaging (PLP), 2.5D/3D integration, TSVs, redistribution layers (RDL), and advanced interconnect technologies.
- Knowledge of semiconductor manufacturing processes and equipment, particularly deposition, surface preparation, thermal processing, or related front-end and back-end technologies.
- Experience working with semiconductor manufacturers, foundries, OSATs, or advanced packaging organizations.
- Strong customer-facing skills with demonstrated success influencing technical and business stakeholders.
- Ability to translate technology trends and customer needs into product strategies and commercial opportunities.
- Proven ability to collaborate effectively across global, cross-functional teams.
- Strong analytical, presentation, and business case development skills.
- Willingness and ability to travel globally (up to 25-35%).
Preferred Qualifications- Direct experience supporting advanced packaging applications for AI, HPC, HBM, or next-generation logic devices.
- Familiarity with hybrid bonding, dielectric and metallization processes, wafer-to-wafer and die-to-wafer integration, or related advanced packaging process technologies.
- Experience with semiconductor capital equipment product management, strategic marketing, or new product introduction.
