Your Team, Your Impact

The CPO Apps team will operates at the intersection of optics, high‑speed electrical design, advanced packaging, and system architecture, providing hands‑on technical support and successfully enable customer adoption of Co‑Packaged Optics at scale.

What You Can Expect

• Act as the primary technical interface for strategic customers designing CPO into GPUs, accelerators, and scale‑up platforms

• Lead customer architecture reviews, design‑in engagements, and deep‑dive technical discussions

• Translate system‑level customer requirements into complete CPO solutions spanning optics, electrical, mechanical, thermal, and test

• Support bring‑up, characterization, debug, and qualification of CPO‑based designs.  Lab skills are a must.

• Provide clear technical guidance, trade‑off analysis, and risk mitigation throughout the customer design cycle

• Drive end‑to‑end CPO solution definition, including:

  • Optical engines and silicon photonics integration

  • High‑speed electrical interfaces (112G+, die‑to‑die, advanced SerDes)

  • Signal integrity, power delivery, thermal, and packaging constraints

  • Mechanical integration into GPU or accelerator packages

• Support host system integration, including board‑level, cooling, and manufacturing considerations

• Perform hands‑on lab‑level test, characterization, debug, and failure analysis of CPO systems

Technical Demo Lead & Owner for Optical Industry Events

What We're Looking For

• Bachelor’s, Master’s, or PhD in Electrical Engineering, Optical Engineering, Photonics, or related field

• 10+ years experience in high‑speed interconnects, optics, and/or advanced packaging

• High‑level knowledge of Co‑Packaged Optics and deployment in large‑scale compute systems

• Deep understanding of:

  • Optical link architectures and budgets

  • High‑speed SI/PI

  • GPU/accelerator packaging and integration constraints

  • CPO test, qualification, and manufacturing considerations

• Proven experience supporting customer design‑ins at the system or package level

• Strong debugging and lab capability across electrical, optical, and thermal domains

• Demonstrated ability to work directly with Tier‑1 customers, lead technical meetings, and drive decisions

• Background in silicon photonics, advanced packaging/chiplets, or CPO manufacturing and test

Expected Base Pay Range (USD)

154,680 - 231,700, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

Interview Integrity 

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

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