We are seeking a highly skilled and motivated Failure Analysis Engineer to join our world-class Failure Analysis Lab. In this role, you wont just solve problems-you will work at the dynamic intersection of physics, process technology, physical design, and circuit design to investigate complex product failures and drive critical engineering solutions. The Mission: Perform Physical Failure Analysis (PFA) on some of the worlds most advanced integrated circuits, deep learning processors, and system architectures, uncovering root causes that directly shape the future of computing. We are looking for an adaptable technical expert capable of translating open-ended challenges into actionable insights. If you excel in fast-paced environments and want to help build the infrastructure defining the modern era, we encourage you to apply.
What Youll Be Doing:Develop Advanced FA Techniques & Methodologies
- Pioneer Novel Methods: Design and implement cutting-edge methodologies to drive successful root-cause investigations on leading-edge silicon, advanced heterogeneous packaging technologies, and complex integrated systems.
- Precision De-processing: Perform mechanical cross-sectioning, parallel de-layering, and advanced chemical/plasma de-processing of integrated circuit (IC) devices across die, package, component, and board levels.
- Nanoscale Analysis: Apply advanced Focused Ion Beam (FIB) sample preparation and analysis techniques to enable high-resolution electrical and physical diagnostics of IC chips.
- Innovate Characterization Platforms: Develop novel characterization techniques and specialized analysis platforms tailored for emerging chip structures with advanced silicon architectures and complex packaging schemes.
- Optimize Workflows: Design and implement robust failure analysis (FA) workflows to improve laboratory efficiency and guarantee accurate, reproducible root-cause determination.
Conduct In-Depth FA Investigations
- Lead Root-Cause Investigations: Head high-impact failure analysis investigations to isolate the root causes of critical failures affecting product yield, performance, and long-term reliability.
- Support multi-functional Engineering: Deliver precise physical characterization data to support engineering teams with Design of Experiments (DOE) evaluations, design optimization, process node improvements, and critical customer FA requests.
What We Need to See:- Domain Expertise: Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and advanced failure analysis methodologies.
- Sample Preparation: Proven proficiency in precision IC device sample preparation for targeted defect localization and physical root-cause analysis.
- Microscopy & Inspection: Hands-on expertise with advanced Optical and Electron microscopy (SEM/TEM), alongside related analytical inspection techniques.
- System-Level Analysis: Strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels.
- Education & Experience: A B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, or a closely related field (or equivalent experience), paired with at least 8 years of relevant, hands-on experience.
Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 144,000 USD - 230,000 USD.
You will also be eligible for equity and benefits.
Applications for this job will be accepted at least until July 13, 2026.
This posting is for an existing vacancy.
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