OverviewMicrosoft's Quantum Systems organization is a multidisciplinary team advancing cutting-edge quantum technologies to address some of the world's most complex challenges. We are seeking a
Senior or Principal Packaging Engineer with a focus on hands-on process and materials development to help shape the future of quantum systems in a dynamic, mission-driven environment.
In this role, you will adapt industry-standard packaging processes and materials to the unique requirements of quantum devices, working alongside a diverse team of engineers and scientists to assemble and scale complex quantum hardware. Success in this position requires close collaboration with our globally distributed team to establish common, robust assembly processes and materials.
Responsibilities- Develop and maintain robust assembly processes for quantum devices. Document processes and implementation across our global team.
- Drive external packaging material vendors to leverage existing supply chains to deliver solutions needed for packaging of quantum devices.
- Evaluate external packaging suppliers as scaling partners.
- Develop and implement test equipment and processes for evaluating packaging solutions.
- Support development of advanced packaging technologies.
- Perform or direct the analysis and simulation of packaging solutions.
- Work in teams or independently as required.
- Other:
- Embody our Culture and Values.
QualificationsRequired/Minimum Qualifications:- Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience.
- OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience.
- OR equivalent experience.
Other Requirements: - Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings:
- Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
- Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
- Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation).
- Evaluate agentic solutions with measurable metrics and human in the loop safeguards following Microsoft Responsible AI requirements for generative AI.
Preferred Qualifications:- Experience managing outside vendors.
- Experience with industry standard chip packaging materials and processes.
- Experience in cryogenic materials.
- Experience in microwave device packaging.
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Hardware Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200 - $261,000 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
Hardware Engineering IC5 - The typical base pay range for this role across the U.S. is USD $142,800 - $274,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
