Job Details:Job Description:Position Summary MDCE is seeking a Senior Member of Technical Staff (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers.
Core Responsibilities Technical Leadership - Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes
- Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield
- Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies
Strategic Execution - Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions
- Technology Transfer: Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production
- Continuous Improvement: Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency
Collaboration & Leadership - Cross-Functional Partnership: Work closely with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams
- Supplier Engagement: Collaborate with equipment and consumables suppliers to co-develop and optimize CMP solutions
- Team Development: Mentor junior engineers and provide technical guidance across the organization
Professional Excellence - Proven Track Record: History of significant technical accomplishments and successful project delivery
- Leadership Capability: Ability to influence and drive results across multiple organizations and disciplines
- Business Acumen: Understanding of semiconductor industry trends, manufacturing strategies, and customer requirements
Personal Attributes - Communication Skills: Exceptional ability to communicate complex technical concepts to diverse audiences
- Adaptability: Thrives in ambiguous situations and can drive clarity in complex technical challenges while work effectively in fast-paced, high-pressure environments
- Initiative: Self-motivated with strong persistence and ability to work independently
- Quality Focus: Meticulous attention to detail with commitment to safety, quality, and compliance standards
Qualifications:The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications - Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
- 7+ years of experience in semiconductor manufacturing / process development or technology development
- 4+ years of direct experience in Chemical Mechanical Planarization (CMP) process development experience with hands-on process tuning and characterization
- Experience with major CMP equipment platforms in one of the following platforms (AMAT, Ebara, etc.)
- Experience with CMP consumables (e.g. slurries, pads, conditioning disks, filters, clean chemistries)
- Previous semiconductor foundry experience
Preferred Qualifications - Doctorate in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
- Experience with advanced technology nodes (e.g. sub-10nm logic, specifically in Gate All Around (GAA) architectures with track record of successful technology development and HVM implementation
- Cross-functional leadership experience, including task force leadership for yield improvement initiatives
- Experience with CMP integration with other process modules (e.g. deposition, lithography, etch, clean) and CMP-relevant metrology with understanding of CMP impact on device performance and yield.
- Experience with CMP-relevant metrology and process control (e.g. thickness, topography, defects, roughness, particles)
Work Environment This role requires in-person collaboration to enable rapid decision-making and effective problem resolution. You'll work in a dynamic, fast-paced environment with competing priorities while maintaining the highest standards for safety, quality, and customer satisfaction.
Impact & Growth Join a team that's reshaping Intel's foundry capabilities and directly influencing the success of next-generation semiconductor technologies. This role offers exceptional opportunities for professional growth, technical leadership, and meaningful impact on Intel's strategic objectives in the foundry market.
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location:US, Oregon, Hillsboro
Additional Locations:US, Arizona, Phoenix
BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $155,520.00-298,440.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this RoleThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
