Job DescriptionJob Summary:- Liaising with the hardware, thermal and PCB design engineers to agree optimal layout and construction of theboards.
- Maintaining awareness of new technologies.
- Reporting to the Engineering Director on project progress.
Required Education, Skills and Experience:- In depth knowledge of solid modelling, drawing, tolerances (GD&T), and change control processes.
- Design of small or precision mechanical components for high complexity densely packed embedded boardlevel electronic sub-systems or similar environments.
- Ability to interface well with remote design teams.
- Familiarity with standard form factor designs, e.g. Open VPX (3U and 6U) or VME.
- Familiarity with shock and vibration testing in general, or of electronic board level systems in particular.
- Experience of team leading at a technical level.
- In addition to technical skills, the candidate must be independent and self-motivated but also be able to interactwith other engineers both locally and overseas.
- It is likely that the role will involve occasional travel to the UK,though this is unlikely to be frequent or for long periods.
QualificationsMechanical
Engineering graduates (BS or MS), able to demonstrate practical post
graduateinvolvement in embedded electronic product design.
Additional InformationRequired Education Minimum of 5 years of electronics packaging experience designing, developing,
documenting and testingboard level and chassis level products.
