Minimum qualifications:- Bachelor's degree in Mechanical Engineering, Product Design, Electrical Engineering, a related field, or equivalent practical experience.
- 5 years of experience in advanced thermal management and product design/development in thermal systems including air and liquid cooling, thermal interface materials, heat sinks, cold plates, high power chip, tray, system/rack cooling.
- 5 years of experience in modeling analyses, numerical modeling including Computational Fluid Dynamics (CFD) tools, and experimental characterization including use of wind tunnels, thermal chambers, and thermal characterization of IT systems.
- Experience in leading project teams related to thermal management technology and product development.
Preferred qualifications:- Master's degree in Mechanical Engineering, Product Design, a related field, or equivalent practical experience.
- 2 years of experience leading technical teams with product development and advanced technology development in thermal management.
- Experience working with cooling strategies used for packages, boards, systems, data centers, and advanced cooling techniques (liquid cooling, thermal interface materials, or heat exchangers).
- Experience working with Original Equipment Manufacturers (OEM), Original Design Manufacturers (ODM), and cooling systems and component supplier.
About the jobAs a Senior Mechanical and Systems Engineer, you will lead projects to design and evaluate the IT/data center thermal systems, identifying product requirements and contributing to research and project planning, from the chip to the data center, you will be responsible for designing and optimizing an architecture that will scale with Google's continued growth.
Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
US: $159000 - $231000 (USD) 15% bonus target equity benefits
Responsibilities- Lead the qualification of thermal products from concept design through production and deployment, partnering with cross-functional teams and external vendors/partners to maintain and improve design, development and qualification processes.
- Contribute to overall system architecture from chip to chiller, and make interdisciplinary tradeoffs to optimize Total Cost of Ownership (TCO) of overall compute infrastructure.
- Develop holistic thermal/mechanical/system designs from package to data center level optimizing for cost and efficiency while innovating for performance.
- Design thermal management hardware including material selection, heat sinks, heat exchangers, air movers, pumps, systems, and cooling systems.
- Establish specifications and test procedures to ensure the desired reliability and performance of electronic equipment, while collaborating with, supervising, mentoring, and motivating both internal and external teams, to design and develop products.
