Senior Manufacturing Engineer - Thin Film Engineering (PVD, PECVD, ALD & RIE)

Ensurge Micropower ASA

$162K — $198K *
Manufacturing & Automotive
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • 7-12+ years in manufacturing engineering within thin-film deposition and etch processes
  • Proven experience managing floor manufacturing processes
  • Strong history of enhancing yield and throughput
  • Expertise in pilot to production scale-up
  • Hands-on approach with equipment and technicians
  • Familiarity with thin-film characterization methods (e.g., ellipsometry, XRD)

Responsibilities

  • Oversee daily performance of PVD/Sputtering, PECVD, ALD, and RIE processes
  • Drive improvements in output, yield, uptime, and cycle time
  • Troubleshoot production issues in real-time
  • Collaborate with Operations for effective line execution
  • Transform R&D processes into consistent production workflows
  • Define and lock critical process parameters and control limits
  • Implement SPC and process controls for quality assurance

Benefits

  • Comprehensive healthcare and wellness programs
  • Opportunities for career development and advancement
  • Collaborative work environment
  • Cutting-edge technology and equipment to aid innovation
  • Employee engagement initiatives for a positive workplace culture
Full Job Description
Role Overview
Ensurge is seeking a Senior Manufacturing Engineer (IC) to own and scale the Thin-Film
Engineering processes - deposition (PVD/Sputtering, PECVD, ALD) and etch (RIE) - from
pilot through early production. This role is not just about process - it is about delivering
manufacturing results.

Responsibilities

Own daily manufacturing performance for the PVD/Sputtering, PECVD, ALD, and RIE
process areas
  • Drive output, yield, uptime, and cycle time
  • Support production directly - troubleshooting issues in real time
  • Partner with Operations to ensure line execution meets plan


Convert R&D processes into repeatable, production-ready workflows
  • Define and lock critical process parameters (CPPs) - e.g., chamber pressure, Ar/process
    gas flow, RF/DC power, substrate bias, deposition rate, film stress and thickness
    uniformity targets (PVD/PECVD); precursor/co-reactant pulse and purge times, cycle
    count, growth per cycle (GPC), and substrate temperature (ALD); RF power, gas
    chemistry (e.g., CF4/O2/Cl2), etch rate, selectivity, sidewall profile/anisotropy, DC bias,
    and endpoint detection (RIE)
  • Define and lock control limits and OCAPs
  • Ensure processes are robust, stable, and scalable
    Work with Equipment Engineering to:
  • Define tool requirements (sputter cathodes/targets, PECVD chambers, ALD reactors and
    precursor delivery systems, RIE/ICP-RIE chambers and endpoint detection systems,
    RF/DC power supplies, vacuum, gas delivery, and abatement/scrubber systems)
  • Improve reliability and uptime
  • Implement process-driven upgrades
  • Lead tool qualification and process acceptance
  • Ensure equipment supports throughput, precision, and repeatability
    Own flow from substrate input 1 deposition/etch 1 downstream handoff to assembly
  • Reduce bottlenecks, WIP, and inefficiencies
  • Improve line balance and production scheduling alignment
  • Support layout and flow improvements as the system scales
    Partner with Quality to implement:
  • SPC and process control on film thickness, stress, uniformity, and conformality
  • Film characterization (ellipsometry, profilometry, XRD, SEM/AFM, four-point probe) to validate deposition results against CPPs
  • Traceability and data capture
    Build and maintain:
  • SOPs
  • Process specs
  • Control plans
  • Ensure manufacturing is data-driven and auditable
    Lead structured RCA on:
  • Yield loss
  • Defects
  • Downtime
  • Use characterization data (SEM, XRD, cross-section imaging) to root-cause excursions
  • Implement sustainable fixes - not workarounds
  • Drive continuous improvement aligned to operational excellence principles (standard work, DMS, etc.)
    Qualifications
    Required
  • 7-12+ years in manufacturing engineering with thin-film deposition and etch
    (PVD/sputtering, PECVD, ALD, and/or RIE) in battery, semiconductor, or thin-film
    industries
  • Proven experience owning manufacturing processes on the floor
  • Strong track record of driving yield and throughput improvements
  • Experience supporting or leading pilot 1 production scale-up
  • Hands-on mindset - comfortable working directly with equipment, technicians, and
    operators
  • Working knowledge of thin-film characterization techniques (e.g., ellipsometry,
    profilometry, XRD, SEM) and their use in validating and controlling deposition processes
    Preferred
  • Understanding of film stress engineering, plasma physics, RF coupling, and DC self-bias
  • Understanding of plasma etch chemistry, selectivity, anisotropy, and endpoint detection
    (RIE/ICP-RIE)
  • Familiarity with ALD precursor chemistry, self-limiting surface reactions, and pulse/purge sequencing
  • Vacuum systems and chamber conditioning experience
  • Experience with image-based film/defect characterization (SEM, optical microscopy) and
    correlating characterization data back to process control limits
  • Experience with MES, traceability systems, or data-driven manufacturing
    Salary Range:
    $162,000-$198,000
    The base salary range is specific to California. The salary of the final candidate selected for this role will be determined by a variety of factors, including, but not limited to, internal equity, experience, education, specialty, and training.

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