Req ID: 137429
Region: Americas
Country: USA
State/Province: Arizona
City: Tucson
SummaryThe Senior Lead Engineer, Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.
Detailed DescriptionPerforms tasks such as, but not limited to, the following:
- Responsible for understanding and implementing the customer's technical roadmap and related process development projects.
- Lead and implement the development and release of the full manufacturing process for new customer products.
- Understand and provide feedback on customer's technical requirements to team members and management
- Responsible for developing and implementing costed and optimized feedback using Design for manufacturability(DFX) tools and processes, with the goal of reducing manufacturing cost and improving quality and reliability of product.
- Develop, plan and lead the assessment of the capability of process applications using Design of Experiments.
- Devise process controls and data collection strategies and evaluate complex data to assist with reporting yield, reliability and diagnoses to root causes failures impacting product quality.
- Ensure accurate and timely communication to management on critical technical and business issues.
Enabling Competencies: - Project Management - Ability to manage/lead complex, multiple line engineering projects that may also involve other functions. Demonstrate solid understanding of the technical, financial and people aspects of the project. Able to create a project/change management plan and ensure that the project is delivered within the assigned time and budget. Ability to recognize project barriers and develop mitigation plans
- Leadership - Demonstrate "People & Team Leadership Behaviors" as per Celestica Leadership Imperatives.
- Financial Acumen / Business Planning - Ability to create financial plans for your projects, align them internally with your line of management and other functions and externally if needed. Create project plans, profitability calculations, risk and sensitivity analysis, able to recognize barriers and mitigate profitability risks. Fully knowledgeable about internal and external financial reporting, accounting and tax requirements relevant to your area of expertise.
- The following competencies may also be required: Coaching/Mentoring; Communication/Negotiation/Presentation; Creative Problem Solving; Customer Interaction/Stakeholder Management; Quality & Lean; Working Effectively with Others; D/PFMEA; 8D/Corrective Action; Equipment Safety; Design of Experiments (DOE).
Knowledge/Skills/Competencies Technical Skills- NPI-PCBA: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, MT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / Phanuel / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA.
- DFX: ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense / Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly / Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assembly (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding), Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills /Edge bonding / Potting, Pack and Ship, Chassis Assembly (fluidics, electrical enclosure, cable routing), Sheet Metal ,Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe)
- FA LAB : ESD Controls, Solder Metallurgy, Strain Gauge Analysis, SIR Testing, Solder Joint Reliability Modeling, Sample Prep (Grind and Polish), Dye & Pry, CMM/VMM, Lab X-Ray, Pull/Bend Testing, Vibration Testing, Drop Testing, TDR, XRF, SEM, FTIR, IC, Solderability Testing, Thermal Analysis, HALT/HASS, TH&B, Thermal Shock, ATC
- OPTICAL & XRAY INSPECTION: ESD Controls, Auto Wire Prep, SMT Data Analytics, API, AOI (PCBA), AXI(PCBA), AOI (System), Test Strategy Creation, IPC-610, Quality Dat (KPI), DFM - Manufacturing, DFA - Assembly, DFT / Physical Test, DFT - Electrical Test
- MACHINING & OTHER: ESD Controls, Pack & Ship, CNC programming, Secondary Processing, Sheet Metal, Machining, Welding, DFM - Manufacturing
- MECHANICAL & SYSTEMS ASSEMBLY: ESD Controls, Wire Harness Assembly, Auto Wire Prep, Mechanical Assembly - System Build, OEE / Industrial Engineering, Pack & Ship, Vacuum System, Fluidics, Electrical Enclosure, Cable Routing, Electrical - Automation, Mechanical - Automation, Machine Vision, IPC-610, Engineering Controls, Quality Data (KPI), Manufacturing Operational Management, DFM - Manufacturing, DFA - Assembly, DFAA -Automated Assembly, DFT - Physical Test
- PCBA ASSEMBLY : ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI),Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes.
- MICROELECTRONICS: ESD Controls, Wafer Thinning, Wafer Singulation, Edge Polishing, Optical Coatings, Die Bonding, Vacuum Reflow, Flip Chip Bonding, Underfill, Active Alignment, Plasma Cleaning, Wire Bonding, Encapsulation, Sealing, Leak Testing, Interconnect Formation
Physical Demands- Duties of this position are performed in a normal office environment.
- Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data.
- Repetitive manual movements (e.g., data entry, using a computer mouse, using a calculator, etc.) are frequently required.
- Occasional travel may be required.
Typical Experience- 4 to 6 years in a similar role or industry.
Typical EducationBachelor degree or consideration of an equivalent combination of education and experience.
Educational Requirements may vary by Geography
NotesThis job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.
This location is a US ITAR facility and these positions will involve the release of export controlled goods either directly to employees or through the employee's movement within the facility. As such, Celestica will require necessary information from all applicants upon an applicant's acceptance of employment to determine if any export control exemptions or licenses must be filed.
