Application close date:
Applications will be accepted on an ongoing basis until the requisition is closed.
The Silicon Systems organization at TeraWave designs, develops, and produces custom silicon solutions for our satellite communications constellation, serving data center, enterprise, and government customers with high-speed internet services. As a Senior IC Packaging Engineer you own Electromagnetic (EM) Simulation for our RFIC and mmWave packaging, with a focus on RF implementation, high-speed signal integrity, and power integrity for integrated circuit packaging. You will work closely with our VP of Silicon Systems and collaborate with RFIC, mmWave, Analog Mixed Signal, and SoC design stakeholders. This is an individual contributor role that may operate as a technical lead for the Electromagnetic Simulation portion of package delivery.
Special Mentions- Relocation provided
- Travel expected up to 15% of the time
- Interviews will include a technical assessment
- This role is based onsite in San Diego, CA, Bay Area, CA. A temporary remote work exception is approved while our San Diego site is being developed.
Responsibilities include but are not limited to:- Own signal and power integrity for RF/Mixed-Signal and mmWave integrated circuit packaging designs.
- Perform signal integrity analysis and HFSS simulation for high-speed signals across package interfaces.
- Design and analyze power delivery networks using HFSS to meet power integrity targets.
- Model and characterize RF and mmWave packaging with HFSS simulation tools and procedures.
- Collaborate with RFIC, mmWave, ASIC, Package Layout, and SoC architecture teams on package requirements.
- Lead the signal and power integrity portion of package delivery as a technical lead.
- Create documentation and specifications and support design reviews for packaging deliverables.
Minimum Qualifications- Bachelor's degree in Electrical Engineering or related field such as Computer Engineering.
- 7+ years of industry experience, or the combination of industry experience and equivalent research from a PhD program.
- Expertise with 2.5D and 3D electromagnetic simulators such as HFSS, EMX, or Momentum.
- Experience with RF modeling, RF impedance, and signal and power integrity for high-speed routing.
- Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
Preferred Qualifications- Advanced degree such as a Master's or PhD in Electrical Engineering or related field.
- Extensive experience with thermal, electromagnetic, and signal integrity simulations at package and system levels.
- Experience mentoring early-career engineers on signal and power integrity practices.
- Strong communication skills and effective cross-functional collaboration across design and architecture teams.
Base Pay Range for:
CA applicants is $230,398.00 - $322,556.85
Other site ranges may differBenefits- Benefits include: Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
- Stock Options for all regular employees (working at least 20 hours/week)
- Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.
- Dependent on role type and job level, employees may be eligible for benefits and bonuses based on the company's intent to reward individual contributions and enable them to share in the company's results, or other factors at the company's sole discretion. Bonus amounts and eligibility are not guaranteed and subject to change and cancellation. Please check with your recruiter for more details.
