WHOOP is seeking a SeniorEmbedded Engineering Program Manager to lead the firmware development for new WHOOP devices. In this role, you will partner closely with Firmware, Hardware, Connectivity, Manufacturing, and WHOOPLabs teams to ensure timely delivery of firmware features to unlock novel WHOOP hardware. You will be a vital part of the growing Hardware EPM team, reporting into the Director of Hardware Program Management.

RESPONSIBILITIES:

• Own firmware program planning and execution across WHOOP's NPI portfolio, ensuring alignment between product, engineering, and operational milestones from concept through launch.
• Develop and maintain integrated firmware schedules, roadmaps, and dependency tracking across multiple concurrent hardware projects.
• Partner with Firmware Engineering Leadership to drive prioritization, capacity planning, risk management, and execution readiness.
• Drive firmware milestone planning, including architecture readiness, feature development, integration, validation, manufacturing readiness, user acceptance testing and launch activities.
• Collaborate closely with Hardware, Connectivity, Sensor Intelligence, Automated Test Engineering, Manufacturing, and WHOOP Labs teams to identify and manage cross-functional dependencies throughout the product development lifecycle.
• Facilitate cross-functional program reviews, status updates, and executive communications, ensuring stakeholders have visibility into progress, risks, and tradeoffs.
• Identify schedule, technical, and resource risks early and lead mitigation planning across engineering and operational teams.
• Support development and validation efforts for Proto/EVT/DVT/PVT, manufacturing bring-up, and launch readiness activities.
• Establish scalable planning processes, tools, and reporting mechanisms to improve predictability and execution across embedded engineering programs.
• Partner with engineering leaders to continuously improve development workflows, release planning, and execution efficiency.

QUALIFICATIONS:

• Degree in Engineering or equivalent practical experience in firmware development.
• 5+ years of experience in Technical Program Management, Engineering Program Management, or related roles supporting embedded systems, firmware, or hardware product development.
• Experience leading complex embedded projects from concept through production release.
• Experience coordinating with hardware engineering, manufacturing, and global external partners.
• Strong understanding of embedded systems development, firmware release processes, and hardware-software integration challenges.
• Strong organizational, multi-tasking, and time management skills with the ability to thrive in fast-paced, ambiguous environments
• Excellent communication and stakeholder management skills, both written and verbal
• Ability to travel internationally to support engineering builds (up to 5%)

This role is based in the WHOOP office located in Boston, MA. The successful candidate must be prepared to relocate if necessary to work out of the Boston, MA office.

Interested in the role, but don't meet every qualification? We encourage you to still apply! At WHOOP, we believe there is much more to a candidate than what is written on paper, and we value character as much as experience. As we continue to build a diverse and inclusive environment, we encourage anyone who is interested in this role to apply.

The WHOOP compensation philosophy is designed to attract, motivate, and retain exceptional talent by offering competitive base salaries, meaningful equity, and consistent pay practices that reflect our mission and core values.

At WHOOP, we view total compensation as the combination of base salary, equity, and benefits, with equity serving as a key differentiator that aligns our employees with the long-term success of the company and allows every member of our corporate team to own part of WHOOP and share in the company's long-term growth and success.

The U.S. base salary range for this full-time position is$130,000 - $185,000. Salary ranges are determined by role, level, and location. Within each range, individual pay is based on factors such as job-related skills, experience, performance, and relevant education or training.

In addition to the base salary, the successful candidate will also receive benefits and a generous equity package..

These ranges may be modified in the future to reflect evolving market conditions and organizational needs. While most offers will typically fall toward the starting point of the range, total compensation will depend on the candidate's specific qualifications, expertise, and alignment with the role's requirements.

Learn more about WHOOP.