THE ROLE:

We are seeking a highly motivated and seasoned engineer to support the package design organization in the development and deployment of AI-driven automation workflows. This role will focus on improving the efficiency, quality, and scalability of complex package, bridge, and interposer design.

The candidate will contribute to accelerating the design of advanced heterogeneous integration technologies, including substrates, silicon interposers, and bridge-based architectures, through automation, and AI-enabled methodologies. This role operates in a fast-paced, results-oriented environment and plays a critical part in enabling next-generation packaging innovation.

THE PERSON:

The ideal candidate :

• Translate complex design challenges into scalable automation solutions
• Work effectively across Design, EDA, and AI/ML teams
• Demonstrate strong problem-solving skills and ownership mindset
• Operate with limited supervision, delivering high-quality results aligned to project goals
• The candidate should be comfortable working in a multi-disciplinary environment and have strong communication skills to collaborate across internal and external stakeholders.

KEY RESPONSIBILITIES:

• Develop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration.
• Apply AI/ML methodologies to enhance key design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification.
• Collaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality.
• Partner with EDA tools teams and vendors to implement automation features, enhance tool capabilities and workflows, support next-generation advanced packaging design enablement
• Develop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams
• Support execution of design milestones and tape-outs, ensuring automation readiness and quality
• Contribute to documentation, best practices, and reusable workflows for broader team adoption

PREFERRED EXPERIENCE:

• Experience in semiconductor packaging or SOC physical design automation
• Strong working knowledge of EDA packaging tools such as Cadence APD / SiP, Siemens Xpedition and Synopsys 3DICC or equivalent
• Expertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++
• Experience applying AI/ML techniques to engineering or design workflows. Familiarity with frameworks such as PyTorch or TensorFlow .
• Understanding of advanced packaging technologies such as 2.5D / 3D IC, Chiplets and heterogeneous integration, Bridge/interposer-based architectures
• Familiarity with Design verification flows (DRC/LVS), Parasitic extraction and SI/PI fundamentals
• Experience working with cross-functional teams (Design, SI/PI, Mechanical, EDA)

ACADEMIC CREDENTIALS:

• Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science or related field.

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Benefits offered are described:  AMD benefits at a glance.

This posting is for an existing vacancy.