Cisco

Semiconductor Packaging Component Quality Engineer

Cisco$154K — $225K *
Telecommunications & Hardware
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field
  • 4+ years of experience in semiconductor quality, packaging reliability, or board-level failure analysis
  • Strong understanding of standard IC packaging types and their material and thermal stress behaviors
  • Strong working knowledge of JEDEC and IPC standards for packaging and reliability testing

Responsibilities

  • Assess and lead the quality and physical integrity of incoming packaged components from suppliers
  • Review supplier data or execute Board Level Reliability testing to ensure interconnect integrity
  • Oversee root-cause analysis on component failures to identify defects
  • Partner with external suppliers and OSATs to audit packaging processes and resolve reliability issues
  • Evaluate supplier-driven package process changes and alignment with quality standards

Benefits

  • Medical, dental, and vision insurance
  • 401(k) plan with company matching
  • Paid parental leave
  • Short and long-term disability coverage
  • Flexible vacation time off program
  • Up to 80 hours of sick time off per year
  • 10 paid holidays and additional paid personal wellness days
  • Volunteering days to support community initiatives
Full Job Description
The application window is expected to close on: 09/14/2026
Meet the Team

The Component Quality and Technology (CQT) organization is seeking a detail-oriented and proactive Semiconductor Packaging Component Quality Engineer to be our technical expert in ensuring the highest standards of component integrity. You will use your deep packaging and board-level expertise to evaluate the quality, reliability, and physical integrity of packaged semiconductor components. We are a global team dedicated to ensuring the highest quality standards. You will work alongside leaders in Quality, Reliability, Component Engineering, and Supply Chain. We pride ourselves on a culture of technical rigor, continuous improvement, and collaborative problem-solving.

What You'll Do

  • Component Packaging Evaluation: Assess and lead the quality and physical integrity of incoming packaged components from external suppliers.
  • Board-Level Reliability: Review supplier-provided data or execute BLR/L2 reliability testing to ensure component-to-board interconnect integrity for best outcomes in SMT manufacturing and long-term field use.
  • Failure Analysis (FA): Oversee root-cause analysis on component failures, identifying package-level defects such as delamination, wire bond lifts, die cracking, and solder joint fatigue.
  • Vendor Quality Management: Partner with external component suppliers and OSATs to audit packaging processes, review manufacturing reliability data, and resolve package-level reliability excursions.
  • Change Assessment: Evaluate supplier-driven package process changes (PCNs) and determine alignment with internal quality standards.


Minimum Qualifications

  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
  • 4+ years of experience in semiconductor quality, packaging reliability, or board-level failure analysis.
  • Strong understanding of standard IC packaging types (e.g., BGA, QFN, WLCSP, Flip-Chip) and their associated material, mechanical, and thermal stress behaviors.
  • Strong working knowledge of JEDEC and IPC standards regarding packaging, reliability testing, and board-level qualifications.


Preferred Qualifications

  • Direct experience designing, setting up, and executing Level 2 (L2) / Board Level Reliability (BLR) testing pipelines, including thermal cycling, mechanical shock/drop testing, board flex testing, and continuous daisy-chain resistance monitoring.
  • Proficiency with reliability software (e.g. Reliasoft, Weibull++, Minitab or JMP) and CAD/PCB layout viewers (e.g. Allegro, Altium)
  • Familiarity with PCB board design principles, footprint layout constraints, and schematic routing that impact package solder joint reliability.
  • Formal training in structured problem-solving methodologies (e.g., 8D, 5-Why, Fishbone analysis, Six Sigma Green/Black Belt).


Message to applicants applying to work in the U.S. and/or Canada:

The starting salary range posted for this position is $154,900.00 to $225,300.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.

Individual pay is determined by the candidate's hiring location, market conditions, job-related skillset, experience, qualifications, education, certifications, and/or training. The full salary range for certain locations is listed below. For locations not listed below, the recruiter can share more details about compensation for the role in your location during the hiring process.

U.S. employees are offered benefits, subject to Cisco's plan eligibility rules, which include medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, paid parental leave, short and long-term disability coverage, and basic life insurance. Please see the Cisco careers site to discover more benefits and perks. Employees may be eligible to receive grants of Cisco restricted stock units, which vest following continued employment with Cisco for defined periods of time.

U.S. employees are eligible for paid time away as described below, subject to Cisco's policies:
  • 10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees
  • 1 paid day off for employee's birthday, paid year-end holiday shutdown, and 4 paid days off for personal wellness determined by Cisco
  • Non-exempt employees** receive 16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees
  • Exempt employees participate in Cisco's flexible vacation time off program, which has no defined limit on how much vacation time eligible employees may use (subject to availability and some business limitations)
  • 80 hours of sick time off provided on hire date and each January 1st thereafter, and up to 80 hours of unused sick time carried forward from one calendar year to the next
  • Additional paid time away may be requested to deal with critical or emergency issues for family members
  • Optional 10 paid days per full calendar year to volunteer


For non-sales roles, employees are also eligible to earn annual bonuses subject to Cisco's policies.

Employees on sales plans earn performance-based incentive pay on top of their base salary, which is split between quota and non-quota components, subject to the applicable Cisco plan. For quota-based incentive pay, Cisco typically pays as follows:
  • .75% of incentive target for each 1% of revenue attainment up to 50% of quota;
  • 1.5% of incentive target for each 1% of attainment between 50% and 75%;
  • 1% of incentive target for each 1% of attainment between 75% and 100%; and
  • Once performance exceeds 100% attainment, incentive rates are at or above 1% for each 1% of attainment with no cap on incentive compensation.


For non-quota-based sales performance elements such as strategic sales objectives, Cisco may pay 0% up to 125% of target. Cisco sales plans do not have a minimum threshold of performance for sales incentive compensation to be paid.

The applicable full salary ranges for this position, by specific state, are listed below:

New York City Metro Area:
$154,900.00 - $259,100.00

Non-Metro New York state & Washington state:
$136,500.00 - $228,300.00

* For quota-based sales roles on Cisco's sales plan, the ranges provided in this posting include base pay and sales target incentive compensation combined.

** Employees in Illinois, whether exempt or non-exempt, will participate in a unique time off program to meet local requirements.

About Cisco

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Industry
Net Income
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Founded
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Revenue
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