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Summary of Role: 

GlobalFoundries is seeking a motivated R&D bonding integration engineer to become part of our Quantum Advanced Packaging team.  This role will entail 3D heterogeneous integration (3DHI) development including wafer-to-wafer and die-to-wafer bonding. 

Essential Responsibilities:  

• Drive 3DHI process development efforts and planning by working with the unit process engineers and directly with the tools & materials suppliers for the Quantum Advanced Packaging projects. 

• Collaborate with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes.   

• Develop expertise in the processes, materials and tooling leveraging available characterization resources.   

• Drive a mechanistic understanding of failure modes. 

• Develop integration schemes to continuously improve yields and to reduce cycle time & costs. 

• Generate IP related to novel wafer integration & packaging technology. 

• Work and collaborate with other teams regarding different assignments as needed. 

Other Responsibilities: 

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs.

• Other duties as assigned bymanager.

Required Qualifications:  

• Education – Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.  

• Prior related internship or co-op experience.   

• Must have at least an overall 3.0 GPA and proven good academic standing.  

• Language Fluency - English (Written & Verbal).  

• Travel - Up to 10%.  

Preferred Qualifications:  

• PhD education level preferred.  

• Fundamental knowledge of semiconductor packaging process modules and integration. 

• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.   

• Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.    

• Strong written and verbal communication skills. 

• Strong planning and organizational skills.  

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