Product Line Manager - Optical I/O ChipletsLocation: San Jose (on-site)
You will own the commercial and technical success of TeraPHY™, our optical I/O chiplet product line - one of the most advanced heterogeneous silicon products in the industry. This is a chip productization role: you drive the product from definition through tapeout, bring-up, qualification, and high-volume manufacturing, then position it to win the AI scale-up market.
We're looking for a product leader who has taken a complex advanced-node chip or SoC from concept to volume production. Experience with networking, optics and photonics is a plus.
Key Responsibilities - Product Strategy & Roadmap: Own the product strategy for the TeraPHY™ optical chiplet family. Author comprehensive PRDs that set the direction for engineering and manufacturing execution.
- Silicon Productization: Drive the chiplet through the full product lifecycle - definition, tapeout, silicon bring-up, reliability qualification, test/yield ramp, and high-volume manufacturing. Steer the product through the internal PLC (Product Life Cycle) gate process in partnership with Engineering, Quality, Operations, and foundry/OSAT partners.
- Market Intelligence: Track the evolution of AI clusters, networking switch fabrics, and disaggregated memory to shape the I/O chiplet roadmap with target customers.
- Technical Marketing: Develop high-quality white papers, datasheets, application notes, and other collateral aimed at customers and partners.
- Customer Engagement: Act as the primary interface for Tier 1 Cloud Service Providers (CSPs), xPU architects, and networking OEMs on chiplet integration, co-packaging, and deployment into their platforms.
Basic Qualifications - Education: BS in Electrical Engineering or equivalent
- Experience: 5+ years in product management or technical product roles for advanced-node silicon - chiplets, I/O die, SoCs, networking ASICs, SerDes, or memory interfaces. Silicon Photonics and optical communications experience is a plus.
- Productization Track Record: Demonstrated ownership of a complex chip from definition through high-volume production, including foundry/OSAT engagement, reliability qualification, and test/yield ramp.
- Technical Depth: Strong grounding in advanced packaging (2.5D/3D, chiplet integration), UCIe or comparable die-to-die interconnect, and high-speed SerDes/signaling.
- Cross-Functional Execution: Strong project management and communication skills. Self-motivated to execute with minimal direction.
Preferred Qualifications - Education : MS in Electrical Engineering or equivalent. MBA is a plus.
Salary range: $170,000 - $223,000
NOTE TO RECRUITERS:
Principals only. We are not accepting resumes from recruiters for this position. Remuneration for recruiting activities is only applicable subject to a signed and executed agreement between the parties. Please don't send candidates to Ayar Labs, and do not contact our managers.
