Nokia

Process Integration Engineer

Nokia$110K — $130K *
Technical Services
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Minimum 2 years experience in a modern semiconductor fab focusing on quality.
  • Knowledge of semiconductor processes and device physics.
  • Familiarity with standard wafer fabrication technologies: epitaxy, wet etching, plasma etching, metal deposition, and photolithography.
  • Understanding of statistical process control methods.
  • Strong attention to detail and quality assurance capabilities.
  • Eagerness to learn and expand technical skills.
  • Excellent problem-solving skills with ownership of tasks.

Responsibilities

  • Troubleshoot performance and yield issues in wafer fabrication.
  • Conduct investigations into reasons for production hold-ups.
  • Support engineers with failure analyses and inspections.
  • Utilize MES software for integration engineering and data analysis.
  • Review SPC charts and manage responses to out-of-control events.
  • Coordinate the movement of materials through fabrication and assembly processes.
  • Manage quality and yield based on process knowledge and data analysis.
  • Resolve deviations and failures through thorough data analysis.
  • Establish and maintain inline fab process specifications.
  • Support process engineering to enhance stability and throughput.
  • Participate in next-gen PIC platform development and technology transfer.

Benefits

  • Opportunity to work in a high-volume semiconductor fabrication facility.
  • Contribute to cutting-edge photonic integration technologies.
  • Collaborative environment with multiple functional teams.
  • Focus on professional development and skill enhancement.
Full Job Description
Job Description

In the position of Process Integration Engineer, you will ensure high quality and reliability of InP-based Photonic Integrated Circuit (PIC) products through extensive experiments and data analysis. You will have the opportunity to help bring up our new high-volume fab in San Jose, CA. You will work with various functional teams to troubleshoot and improve wafer fabrication processes and drive improvements in yield reliability

Responsibilities

Your Key Responsibilities:
  • Troubleshoot challenging performance and yield issues in the wafer fab
    • Investigate the reason and root cause for lots being put on hold
    • Provide support for engineers with failure analysis - visual inspections, CD-SEM work, electrical IV sweeps, profilometer depth measurements, etc.
    • Use Manufacturing Engineering System (MES) software to help with integration engineering activities - collect data, perform basic data analysis, generate Power Point reports, etc.
    • Routine review of SPC charts and initial response for out-of-control events
    • Coordinate and follow movement of qual and development lots through fab, assembly, and test areas
    • Manage quality and yield of PIC wafers based on knowledge of fab processes, device physics, and the analysis of test and reliability data
    • Troubleshoot and resolve process deviations and test failures through a detailed analysis of test data and process history
    • Establish and maintain inline FAB process specifications.
    • Support Process Engineering to improve process stability and capability
    • Support Operations to improve throughput and cycle time
    • Support next-generation PIC platform development and participate in technology development, transfer, and ramp activities to meet yield, reliability and device performance goals
    • Help to assure compliance with PIC product quality system


Qualifications

Minimum Knowledge/Skills/Abilities:
  • At least 2 years of experience working in a modern semiconductor fab which places a high premium on quality.
    • Understanding of semiconductor processes and device physics
    • Understanding of statistical process control methods
    • Familiarity with or direct experience in most of the standard semiconductor process technologies required for wafer fabrication such as epitaxy, wet etching, plasma etching, metal deposition, and photolithography
    • Strong focus on quality and attention to detail
    • Eager to learn and expand skill set
    • Strong follow-up skills and problem-solving ability and drive
    • Takes ownership for tasks and projects
    • Team-player with good communication skills, verbal and written
    • Ability to organize data and keep track of several simultaneous projects and deadlines

Education Required:
  • B.S. or higher in Electrical Engineering, Photonics, Physics, or Materials Science with at least 2 years of semiconductor fab experience.

About Nokia

Nokia is a Finnish multinational telecommunications, information technology, and consumer electronics company. The company was founded in 1865 and has since grown to become one of the largest telecommunications equipment manufacturers in the world. Nokia's products include mobile phones, smartphones, and network equipment, among others. The company is committed to innovation and has a strong focus on research and development. Nokia is also committed to sustainability and has set ambitious targets for reducing its environmental impact. The company operates in over 100 countries and has a strong presence in Europe, Asia, and North America.
Learn more about Nokia
Size
87,927 employees
Market Cap
$25.8 billion
Industry
Net Income
-$2.5 billion
Founded
1865
5 Year Trend
-1.2%
Revenue
$21.8 billion
NASDAQ

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