Oracle Corporation

Principal Thermal Engineer

Oracle Corporation$114K — $234K *
Manufacturing & Automotive
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's or Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science, or a related field.
  • 5+ years of experience in thermal systems engineering, particularly in liquid cooling for high-performance computing or data centers.
  • Hands-on experience with manufacturing processes and technology transfer.
  • Strong understanding of reliability and performance challenges specific to liquid cooling systems.
  • Proven track record in supplier development and technical troubleshooting.

Responsibilities

  • Lead the technical implementation of direct-to-chip liquid cooling systems in collaboration with manufacturers and stakeholders.
  • Create and manage specifications and requirements for cooling solutions.
  • Supervise the mass production and qualification processes at external manufacturing sites while ensuring compliance with standards.
  • Drive resolution of manufacturing challenges related to liquid cooling technologies.
  • Assess engineering designs to ensure they meet various system-level requirements.
  • Conduct audits of supplier processes for regulatory compliance.
  • Enhance cooling designs based on feedback and real-world data.

Benefits

  • Comprehensive medical, dental, and vision insurance including expert opinions.
  • Short-term and long-term disability coverage.
  • 401(k) plan with company matching contributions.
  • Flexible vacation and 13 to 18 days of annual leave based on tenure.
  • Paid parental leave and adoption assistance.
Full Job Description
Job Description

We are seeking a skilled engineer or scientist to lead the deployment and management of direct-to-chip liquid cooling technology with our external manufacturing partners. The successful candidate will ensure robust technical implementation, drive quality standards, oversee supplier collaboration, and support the innovation of advanced thermal management solutions.

Responsibilities

Key Responsibilities
  • Serve as the technical lead for direct-to-chip liquid cooling systems with a focus on collaboration across external manufacturers and internal stakeholders.
  • Develop and maintain technical specifications and requirements for direct-to-chip cooling solutions.
  • Oversee the qualification, integration, and mass production of liquid cooling systems at external manufacturing sites, ensuring adherence to company quality, safety, and performance standards.
  • Drive joint problem-solving efforts on yield, performance, and manufacturing challenges related to liquid cooling technologies.
  • Review and validate engineering designs, ensuring alignment with system-level requirements (mechanical, fluid, thermal, and electrical interfaces).
  • Review and audit supplier manufacturing processes for compliance with company and industry regulations.
  • Support the continuous improvement of cooling designs based on manufacturing feedback and field data.
  • Prepare, review, and maintain documentation, including test plans, technical reports, process control documents, and validation results.
  • Provide technical training and guidance to manufacturing partners as needed.


Skills
  • Bachelor's or Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science, or a closely related field.
  • 5+ years of experience in thermal systems engineering, preferably with direct experience in liquid cooling for high-performance computing or data centers.
  • Hands-on experience with manufacturing processes, supplier management, and technology transfer.
  • Strong understanding of liquid cooling-specific reliability, safety, and performance challenges.
  • Demonstrated experience in supplier development, process audit, and technical troubleshooting.
  • Excellent verbal and written communication skills; able to translate complex technical information for varied audiences.
  • Ability to travel domestically and internationally to manufacturing sites as required.
  • Experience with cold plate cooling systems.
  • Familiarity with industry standards, guidelines, and environmental compliance for data center cooling (ASHRAE, OCP, RoHS, etc).
  • Prior exposure to scaling cooling systems from lab/POC to mass production.
  • Exposure and experience with coolant chemistries and technologies.


Qualifications

Disclaimer:

Certain U.S. based or U.S. customer or client-facing roles may be required to comply with applicable requirements, such as immunization/occupational health mandates, and/or drug testing requirements.

Range and benefit information provided in this posting are specific to the stated locations only

US: Hiring Range in USD from: $114,600 to $234,600 per annum. May be eligible for bonus, equity, and compensation deferral.

Oracle maintains broad salary ranges for its roles in order to account for variations in knowledge, skills, experience, market conditions and locations, as well as reflect Oracle's differing products, industries and lines of business.
Candidates are typically placed into the range based on the preceding factors as well as internal peer equity.

Oracle US offers a comprehensive benefits package which includes the following:
1. Medical, dental, and vision insurance, including expert medical opinion
2. Short term disability and long term disability
3. Life insurance and AD&D
4. Supplemental life insurance (Employee/Spouse/Child)
5. Health care and dependent care Flexible Spending Accounts
6. Pre-tax commuter and parking benefits
7. 401(k) Savings and Investment Plan with company match
8. Paid time off: Flexible Vacation is provided to all eligible employees assigned to a salaried (non-overtime eligible) position. Accrued Vacation is provided to all other employees eligible for vacation benefits. For employees working at least 35 hours per week, the vacation accrual rate is 13 days annually for the first three years of employment and 18 days annually for subsequent years of employment. Vacation accrual is prorated for employees working between 20 and 34 hours per week. Employees working fewer than 20 hours per week are not eligible for vacation.
9. 11 paid holidays
10. Paid sick leave: 72 hours of paid sick leave upon date of hire. Refreshes each calendar year. Unused balance will carry over each year up to a maximum cap of 112 hours.
11. Paid parental leave
12. Adoption assistance
13. Employee Stock Purchase Plan
14. Financial planning and group legal
15. Voluntary benefits including auto, homeowner and pet insurance

The role will generally accept applications for at least three calendar days from the posting date or as long as the job remains posted.
Career Level - IC4

About Oracle Corporation

Oracle Dyn Global Business Unit is a pioneer in managed DNS and a leader in cloud-based infrastructure that connects users with digital content and experiences across a global internet. Dyn's solution is powered by a global network that drives 40 billion traffic optimization decisions daily for more than 3,500 enterprise customers, including preeminent digital brands such as Netflix, Twitter, Linkedin and CNBC. Adding Dyn's best-in-class DNS and email services extend the Oracle cloud computing platform and provides enterprise customers with a one-stop shop for Infrastructure-as-a-Service (IaaS) and Platform-as-a-Service (PaaS). On January 31, 2017 Oracle completed the acquisition of Dyn, which now operates as an Oracle Infrastructure-as-a-Service (IaaS) global business unit (GBU).

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Learn more about Oracle Corporation
Size
143,000 employees
Market Cap
$217.3 billion
Industry
Net Income
$12.8 billion
Founded
1977
5 Year Trend
+2.3%
Revenue
$39.6 billion
NASDAQ

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