ARM

Principal Test Engineer

ARM$249K — $338K *
Manufacturing & Automotive
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • 12+ years in semiconductor manufacturing, ATE test development, or related fields.
  • Expertise in Advantest 93K, SmarTest 7/8, and production integration.
  • Strong background in HSIO test/debug and various semiconductor protocols.
  • Proven experience in end-to-end project execution from architecture to production ramp.
  • Excellent cross-functional collaboration skills with engineering teams, vendors, and OSATs.

Responsibilities

  • Own end-to-end test enablement for upcoming silicon projects.
  • Drive first-silicon bring-up, including characterization execution and issue resolution.
  • Define ATE characterization plans for various testing metrics.
  • Develop and maintain ATE test methods and production test content.
  • Guide ATE hardware development with vendors to ensure readiness.
  • Collaborate with cross-functional teams to debug issues and improve test quality.

Benefits

  • Flexible hybrid work environment tailored to team needs.
  • Commitment to equitable and competitive rewards for contributions.
  • Support for accommodations during the recruitment process.
  • Emphasis on personal well-being alongside performance.
Full Job Description
Job Overview:

The Principal Test Engineer is responsible for owning ATE test enablement, first-silicon bring-up, characterization, and production release for complex SoCs on Advantest 93K. This role drives manufacturing test execution across wafer sort, final test, SLT, OSAT release, and HVM, with strong emphasis on test architecture, SmarTest 8, Advantest 93K hardware, HSIO methodology, functional test, structural test integration, ATE hardware readiness, and scalable production execution.

This role requires 12+ years of experience in semiconductor manufacturing and test, with deep hands-on expertise in Advantest 93K, SmarTest 7 / SmarTest 8, test program development, HSIO test/debug, ATE characterization, pattern conversion, test method development, binning strategy, and cross-functional execution with Design, DFT, Product Engineering, vendors, third-party teams, and OSATs.

Responsibilities:

  • Own test enablement for upcoming silicon projects, including ATE strategy, Advantest 93K hardware configuration, SmarTest 8 program structure, test flow development, debug visibility, datalogging, and manufacturing readiness.
  • Drive first-silicon bring-up on ATE, including daily progress reporting, issue triage, silicon/ATE debug, characterization execution, correlation, and handoff from engineering bring-up to CP, FT, SLT, OSAT, and HVM release.
  • Define and implement ATE characterization plans across voltage, frequency, temperature, process, functional content, HSIO margins, structural coverage, binning strategy, guardbands, and production limits.
  • Develop and maintain ATE test methods, flows, revision-control framework, pattern conversion infrastructure, and production test content for functional, HSIO, ATPG/Scan, MBIST, PHY BIST, DC, leakage, IDDQ, and other manufacturing test types.
  • Guide ATE test hardware development with vendors and OSATs, including wafer probe card, load board, socket, thermal control interface, tester resources, HSIO connectivity, signal integrity, power delivery, and active thermal management.
  • Work with Design, DFT, Firmware, Product Engineering, third-party contractors, offshore teams, ATE suppliers, and OSATs to debug complex issues, improve test quality, close coverage gaps, and deliver production-ready test solutions on schedule.


Required Skills and Experience :

  • 12+ years of experience in semiconductor manufacturing, ATE test development, product engineering, silicon bring-up, characterization, or production release for complex SoCs, CPUs, AI accelerators, chiplet-based devices, or advanced semiconductor products.
  • Expert hands-on knowledge of Advantest 93K ATE test program development, including SmarTest 7 / SmarTest 8, tester hardware, digital patterns, test methods, test flow development, datalogging, debug flows, binning, revision control, and production integration.
  • Strong experience in test architecture and HSIO test/debug, including PCIe, UCIe, DDR, SerDes, PHY BIST, protocol-based test, IO topology, bench-to-ATE correlation, oscilloscopes, BERTs, emulation, simulation, and production margining.
  • Working understanding of functional testing, structural test integration, DFT concepts, PHY BIST, silicon fabrication process, packaging, product qualification, manufacturing steps, and HVM release requirements.
  • Experience owning end-to-end project execution from architecture through first silicon, bring-up, characterization, CP/FT deployment, OSAT release, production ramp, yield debug, and continuous improvement.
  • Strong ability to work across Design, DFT, Firmware, Product Engineering, vendors, OSATs, third-party teams, and customers, with proven debug capability across silicon, ATE hardware, SmarTest software, patterns, firmware, package/board design, HSIO IP, and manufacturing flows.


Additional Information

Please note that no relocation package is available for this role.

#LI-RJ1

Salary Range:

$249,900-$338,100 per year
We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.

Accommodations at Arm

At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email [redacted] . To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.

Hybrid Working at Arm

Arm's approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team's needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.

About ARM

ARM Holdings is a British multinational semiconductor and software design company, owned by SoftBank Group and its Vision Fund. With its headquarters in Cambridge, England, the company designs microprocessors, physical intellectual property (IP) and related technology and software, and sells development tools to deliver complete solutions for the digital world. ARM's technology is used in a wide range of applications, including automotive, consumer electronics, and Internet of Things (IoT) devices. The company was founded in 1990 and has grown to become one of the world's leading semiconductor IP companies.
Learn more about ARM
Size
6,000 employees
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