Join a highly innovative engineering organization building next‑generation semiconductor capital equipment components and sub-assemblies. As a Principal Systems/Mechanical Engineer, you will analyze, improve, and define subsystem architectures that directly influence system performance, throughput, and reliability for customers at the forefront of semiconductor equipment manufacturing.
- We are seeking a highly skilled Principal Systems/Mechanical Engineer, Semiconductor to lead the design and integration of complex subsystems used in advanced semiconductor capital equipment.
- You will architect mechanical, thermal, fluid, and structural solutions that drive system performance and reliability, working closely with customers and cross‑functional teams across the full product lifecycle.
- This is a high‑impact technical leadership role with significant influence over subsystem architecture, innovation, and customer success.
What will you do?
This role partners with the business unit, world-class customers, engineering centers, operational sites, and strategic suppliers globally to solve complex multidisciplinary design, manufacturing, and supply chain challenges. Specific examples include:
Co-Innovation Through Subsystem Architecture & Design
- Analyze, refine, architect and design mechanical subsystems including robotics/mechatronics, vacuum and gas delivery, power systems, and precision mechanical assemblies.
- Develop detailed CAD models and engineering drawings for weldments, sheet metal, machined parts, and assemblies.
- Analyze, refine, and define system and subsystem interfaces, requirements, and specifications.
- Develop and maintain interface control documents (ICDs).
- Lead requirements decomposition and ensure bi-directional traceability.
- Establish subsystem validation strategies and verification plans.
Analysis & Verification
- Perform structural, thermal, dynamic, and vacuum-related analyses using advanced FEA tools.
- Lead risk assessments including FMEAs, root cause analysis, and structured problem‑solving.
- Validate system reliability through load‑path evaluation, stress analysis, fatigue modeling, and environmental considerations.
Technical Leadership & Cross‑Functional Integration
- Lead cross‑functional design reviews and drive subsystem integration, optimization, and design validation.
- Collaborate with global teams, suppliers, and customers to refine requirements and resolve technical issues.
- Champion DFX, VAVE, Lean methodologies, and continuous improvement initiatives.
- Mentor early‑career engineers, elevate technical standards, and influence engineering culture by role modeling key attributes of leadership and ownership.
- Make high-impact technical decisions that influence product performance and industry competitiveness.
- Represent engineering in customer engagements and roadmap discussions.
Lifecycle, Compliance & Supply Chain Support
- Support NPI, RFQ processes, qualification testing, and component lifecycle management.
- Ensure design compliance with global regulatory standards (UL, CE, RoHS, REACH).
- Develop and maintain robust documentation including BOMs, specifications, test plans, qual plans, and ECOs.
- Partner with product management, operations, supply chain, and finance to ensure solutions meet cost, reliability, and schedule targets.
How will you get here?
Required
- Bachelor’s degree in mechanical, systems, or related engineering field.
- 5+ years experience in semiconductor capital equipment or wafer‑fab, advanced packaging environments.
- Expertise in mechanical design, precision systems engineering, mechatronics, power systems, and fluid/vacuum systems.
- Proficiency in FEA, CAD, and structural/thermal analysis tools.
- Strong communication, documentation, and cross‑functional collaboration skills.
- Demonstrated ability to lead reviews, guide teams, and interface with customers.
- Ability to travel domestically and internationally up to 30%.
Preferred
- MS in mechanical or systems engineering
- Experience in semiconductor mechanical system design
- Hands‑on prototyping and global supplier engagement
Why Join Us?
- Work on cutting‑edge semiconductor capital equipment with major industry leaders.
- Drive subsystem architecture and innovation in high‑impact technologies.
- Collaborate with global teams and customers on complex, multidisciplinary challenges.
- Enjoy opportunities for technical leadership, creativity, and career advancement.
- Engineer mission‑critical systems that shape the next generation of semiconductor manufacturing platforms.
- In close partnership with customers, drive complex subsystem optimization end‑to‑end – from concept architecture to validation and production.
- Collaborate with leading global semiconductor equipment manufacturers.
- Drive innovation in high-precision, high‑vacuum, and high‑reliability environments.
The pay range for this role is $126,100 - $227,000. Job-related, non-discriminatory factors used to determine the actual offered rate include qualifications and experience, geographic location, education, external market data, and consideration of internal equity. The anticipated close date of this job requisition is: .
As part of the total rewards package, this position is eligible for a short-term incentive based on performance. In addition, Jabil offers benefits to enhance your health, wealth, and resilient self. These include medical, dental, and vision insurance plans; paid time off accruing at a rate of 3.07 hours during your first year of employment; 4 weeks of paid parental leave; in 2026, 11 company-paid holidays (9 fixed holidays and 2 optional floating holidays), subject to change yearly; 401(k) retirement plan; and employee stock purchase plan.
